Apparatus for producing semiconductor device, and method for producing semiconductor device
AssigneeYamaha Robotics Co., Ltd.
InventorsKohei Seyama, Makoto Takahashi
Life of this patent
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AssigneeYamaha Robotics Co., Ltd.
InventorsKohei Seyama, Makoto Takahashi
Estimating the term…
An apparatus for producing a semiconductor device comprises a stage, a bonding head, a bonding tool and a first camera that are attached to the bonding head, and a controller, the apparatus moreover being such that the controller is configured to execute for each of one or more points: a process of mounting an inspection chip on a mounting surface; a process of acquiring, as an inspection image, an image of the mounting surface after the inspection chip has been mounted thereon captured by the first camera; a process of calculating, as an area correction amount C, a correction amount for a camera offset amount Ocm on the basis of the position of the inspection chip in the inspection image; and a process of associating the calculated area correction amount C and the position of a discretionary point and then storing the associated information in a storage device.
An apparatus for producing a semiconductor device comprising:
An apparatus for producing a semiconductor device comprising:
Dependencies are inferred from the claim text.