High precision component alignment sensor system
AssigneeCyberOptics Corporation
InventorsTimothy A. Skunes, Steven K. Case, Curtis J. Bocchi
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AssigneeCyberOptics Corporation
InventorsTimothy A. Skunes, Steven K. Case, Curtis J. Bocchi
Estimating the term…
A high speed high precision laser based alignment sensor system for use on surface mount component placement machines. A laser system is utilized to correctly align and position component parts which range between 0.02 inches and 2.0 inches in size. The laser sensor system consists of a laser light source which is passed through a collimating lens and then through an aperture to create a stripe of collimated laser light which is focused past the component being aligned to strike a multi-element CCD sensor array. The sensor system is mounted directly on the carrying mechanism for the surface mount component placement machine. During transit of the component between the bin of components and the circuit board upon which the component is to be placed, the component is rotated and the shadow which falls on the detector array is monitored. When the minimum width of shadow is detected, the correct angular orientation is determined, the average of the edges of the shadow when compared with the center of the quill determines the coordinate (X,Y) location of the component on the quill. Two alignments normally occur displaced by 90.degree.. Thereafter, the sensor sends correcting signals to the component placement machine to assure the correct angular orientation and the correct X,Y position for the component to be placed on the circuit board by the component placement machine.
A laser based high precision high speed component alignment sensor system comprising:
In a surface mount component placement machine having means for picking up a semiconductor component, a means for directly transporting the component to a work piece, a means for rotating the component and means for accurately placing the component on the work piece, the improvement comprising:
A method for aligning a component carried by a surface mount component placement machine having a vacuum quill comprising:
A laser sensor comprising a laser light source and a sensor array for use in precisely placing a semiconductor component having various edges carried on a transport means, the transport means having control means connected to the transport means for causing the semiconductor component to be interposed between the laser light source and the sensor array and for incrementally rotating the semiconductor component to cause variation in the position of the shadow cast by at least one edge associated with the semiconductor component on the array as the semiconductor component is rotated, the sensor comprising:
A method of orienting a semiconductor component carried on a transport means, the method comprising:
A method for determining the proper lateral and angular orientation of a component interposed between a laser light source and a multi-element photo detector array, each element comprising a pixel, comprising:
Dependencies are inferred from the claim text.