H05K 1/181
Associated with surface mounted components
Official title: associated with surface mounted components
H05K1/181 (Associated with surface mounted components) appears on 7,314 US grants and 8,952 published applications in this corpus.
Search patents in H05K- Granted patents
- 7,314
- Published applications
- 8,952
- Assignees
- 2,216
- Inventors
- 16,281
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 4 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 8 | 0 |
| 1988 | 11 | 0 |
| 1989 | 6 | 0 |
| 1990 | 10 | 0 |
| 1991 | 20 | 0 |
| 1992 | 12 | 0 |
| 1993 | 21 | 0 |
| 1994 | 28 | 0 |
| 1995 | 33 | 0 |
| 1996 | 36 | 0 |
| 1997 | 29 | 0 |
| 1998 | 29 | 0 |
| 1999 | 39 | 0 |
| 2000 | 39 | 0 |
| 2001 | 42 | 17 |
| 2002 | 41 | 66 |
| 2003 | 52 | 60 |
| 2004 | 57 | 97 |
| 2005 | 65 | 82 |
| 2006 | 48 | 110 |
| 2007 | 64 | 105 |
| 2008 | 60 | 123 |
| 2009 | 69 | 114 |
| 2010 | 71 | 132 |
| 2011 | 104 | 108 |
| 2012 | 93 | 118 |
| 2013 | 95 | 193 |
| 2014 | 117 | 249 |
| 2015 | 219 | 476 |
| 2016 | 328 | 424 |
| 2017 | 463 | 586 |
| 2018 | 520 | 738 |
| 2019 | 703 | 809 |
| 2020 | 744 | 759 |
| 2021 | 620 | 620 |
| 2022 | 548 | 586 |
| 2023 | 528 | 624 |
| 2024 | 488 | 593 |
| 2025 | 540 | 569 |
| 2026 | 300 | 594 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board and electronic device6 Oct 2026US 12,757,322 B2Shenzhen Jufei Optoelectronics Co., Ltd.
- Multilayer substrate, method for manufacturing multilayer substrate, and electronic device6 Oct 2026US 12,757,329 B2Fict Limited
- Power converter using a planar energy transfer element6 Oct 2026US 12,757,345 B2Power Integrations, Inc.
- Solid-state imaging device and imaging apparatus6 Oct 2026US 12,757,513 B2Sony Semiconductor Solutions Corporation
- Portable power case6 Oct 2026US 12,757,523 B2LAT Enterprises, Inc.
- Electronic device8 Oct 2026US 2026/0311925 A1Denso Corporation
- Drive unit8 Oct 2026US 2026/0312508 A1Mitsubishi Electric Corporation
- Optical receiver8 Oct 2026US 2026/0312695 A1Nippon Telegraph and Telephone Corporation
- Systems with vertical power distribution network vias and multiple printed circuit board subassemblies8 Oct 2026US 2026/0313786 A1
- Circuit board and semiconductor package comprising same8 Oct 2026US 2026/0313791 A1LG Innotek Co., Ltd.
Most cited
By later US patents
- Encapsulated semiconductor device package having holes for electrically conductive material423US 5,608,265 AHitachi, Ltd. · 1997
- Low-cost accelerometer370US 6,336,365 B12002
- Bi-level microelectronic device package with an integral window296US 6,674,159 B1Sandia National Laboratories · 2004
- Radio frequency tag265US 5,995,006 AIntermec IP Corp. · 1999
- Mirror reflective element assembly including electronic component260US 7,446,924 B2Donnelly Corporation · 2008