H05K 1/0295
Adapted for choosing between different types or different locations of mounted components
Official title: {adapted for choosing between different types or different locations of mounted components}
H05K1/0295 (Adapted for choosing between different types or different locations of mounted components) appears on 268 US grants and 255 published applications in this corpus.
Search patents in H05K- Granted patents
- 268
- Published applications
- 255
- Assignees
- 207
- Inventors
- 638
- Latest grant
- 21 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 3 | 0 |
| 1992 | 1 | 0 |
| 1993 | 4 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 4 | 0 |
| 1997 | 5 | 0 |
| 1998 | 7 | 0 |
| 1999 | 8 | 0 |
| 2000 | 9 | 0 |
| 2001 | 8 | 3 |
| 2002 | 7 | 6 |
| 2003 | 8 | 13 |
| 2004 | 11 | 9 |
| 2005 | 5 | 5 |
| 2006 | 6 | 9 |
| 2007 | 4 | 12 |
| 2008 | 8 | 18 |
| 2009 | 8 | 20 |
| 2010 | 7 | 19 |
| 2011 | 11 | 15 |
| 2012 | 18 | 10 |
| 2013 | 13 | 12 |
| 2014 | 6 | 8 |
| 2015 | 10 | 10 |
| 2016 | 3 | 10 |
| 2017 | 10 | 7 |
| 2018 | 13 | 8 |
| 2019 | 6 | 6 |
| 2020 | 7 | 7 |
| 2021 | 5 | 9 |
| 2022 | 11 | 5 |
| 2023 | 3 | 10 |
| 2024 | 9 | 8 |
| 2025 | 8 | 8 |
| 2026 | 5 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- PCB land pad for three-pin MOSFET component21 Apr 2026US 12,610,464 B2Micron Technology, Inc.
- Electronic device comprising printed circuit board17 Mar 2026US 12,581,598 B2Samsung Electronics Co., Ltd.
- Soldering board arrangement3 Mar 2026US 12,568,580 B2PHYTEC Messtechnik GmbH
- Device and method for replacing at least one chip27 Jan 2026US 12,538,609 B2OSRAM Opto Semiconductors GmbH
- Educational electronics systems and methods6 Jan 2026US 12,520,419 B1Heathkit Company, Inc.
- Circuit board, circuit board assembly, and electronic device27 Aug 2026US 2026/0255480 A1Honor Device Co., Ltd.
- Pcb land pad for three-pin mosfet component30 Jul 2026US 2026/0223289 A1Micron Technology, Inc.
- Printed circuit board, image forming apparatus, and system4 Jun 2026US 2026/0156745 A1Canon Kabushiki Kaisha
- Information processing apparatus, information processing system, writing jig, and writing method30 Apr 2026US 2026/0119443 A1Lenovo (Singapore) Pte. Ltd.
- Printed board, image forming apparatus, and mounting method12 Mar 2026US 2026/0072392 A1Canon Kabushiki Kaisha
Most cited
By later US patents
- Interconnect adapter and head suspension assembly185US 6,025,988 ARead-Rite Corporation · 2000
- SIMM/DIMM memory module156US 6,111,757 AInternational Business Machines Corporation · 2000
- Memory module121US 6,038,132 AMitsubishi Denki Kabushiki Kaisha · 2000
- Ultra-small LED electrode assembly and method for manufacturing same114US 9,773,761 B2Psi Co., Ltd. · 2017
- Printed circuit board and method for wiring signal lines on the same70US 6,233,157 B1Hyundai Electronics Industries Co., Ltd. · 2001