PCB land pad for three-pin MOSFET component
AssigneeMicron Technology, Inc.
InventorShriram Harihara Subramanian
Life of this patent
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Abstract
A printed circuit board (PCB) land pad for a three-pin metal-oxide-semiconductor field-effect transistor (MOSFET) component comprises four pads with a split pad for a drain terminal of the MOSFET component. The PCB land pad comprises: a first pad to connect a gate terminal of the MOSFET component to a PCB; a second pad to connect a source terminal of the MOSFET component to the PCB; a third pad corresponding to connect a drain terminal of the MOSFET component to the PCB; and a fourth pad to connect the drain terminal of the MOSFET component to the PCB.
Claims13
An assembled printed circuit board (PCB) comprising:
- a PCB comprising a land pad for a three-pin metal-oxide-semiconductor field-effect transistor (MOSFET) component, the land pad comprising a gate pad, a source pad, a first drain pad, and a second drain pad;
- and
- a three-pin MOSFET component soldered to the land pad of the PCB, the MOSFET component comprising a gate terminal, a source terminal, and a drain terminal, the gate terminal being soldered to the gate pad, the source terminal being soldered to the source pad, the drain terminal being soldered to the first drain pad and the second drain pad.
A method for producing an assembled printed circuit board (PCB), the method comprising:
- applying a solder mask to a copper layer of a PCB, the solder mask defining a land pad for a metal-oxide-semiconductor field-effect transistor (MOSFET) component, the land pad comprising a gate pad, a source pad, a first drain pad, and a second drain pad, the MOSFET component comprising a gate terminal, a source terminal, and a drain terminal;
- applying solder paste to the solder masked copper layer, the applying of solder paste comprising applying solder paste to the gate pad, the source pad, the first drain pad, and the second drain pad;
- placing the MOSFET component on the land pad, the placing of the component on the land pad comprising placing the drain terminal of the MOSFET component on the first drain pad and the second drain pad;
- and
- creating permanent solder joints between the MOSFET component and the land pad, the creating of permanent solder joints comprising melting the solder paste to solder the drain terminal to the first drain pad and to the second drain pad.
Dependencies are inferred from the claim text.