H05K 1/0256
Electrical insulation details
Official title: {Electrical insulation details, e.g. around high voltage areas}
H05K1/0256 (Electrical insulation details) appears on 262 US grants and 296 published applications in this corpus.
Search patents in H05K- Granted patents
- 262
- Published applications
- 296
- Assignees
- 225
- Inventors
- 737
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 7 | 0 |
| 1999 | 5 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 0 |
| 2002 | 9 | 11 |
| 2003 | 8 | 3 |
| 2004 | 8 | 12 |
| 2005 | 4 | 10 |
| 2006 | 7 | 11 |
| 2007 | 6 | 7 |
| 2008 | 4 | 17 |
| 2009 | 13 | 11 |
| 2010 | 5 | 11 |
| 2011 | 13 | 9 |
| 2012 | 11 | 8 |
| 2013 | 6 | 12 |
| 2014 | 11 | 13 |
| 2015 | 8 | 17 |
| 2016 | 12 | 10 |
| 2017 | 13 | 7 |
| 2018 | 11 | 12 |
| 2019 | 11 | 10 |
| 2020 | 11 | 7 |
| 2021 | 8 | 6 |
| 2022 | 8 | 20 |
| 2023 | 6 | 19 |
| 2024 | 17 | 15 |
| 2025 | 13 | 23 |
| 2026 | 10 | 15 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Selective removal of adhesive from coverlay for printed circuit board insulation25 Aug 2026US 12,720,671 B2Rockwell Collins, Inc.
- Circuit board and semiconductor package comprising same28 Jul 2026US 12,696,390 B2LG Innotek Co., Ltd.
- Low-transmission-loss copper-based composite material and preparation method thereof, PCB, and electronic component30 Jun 2026US 12,668,890 B2Songshan Lake Materials Laboratory
- Printed circuit board and manufacturing method thereof30 Jun 2026US 12,672,233 B2Samsung Electro-Mechanics Co., Ltd.
- Flexible printed circuit board, COF module, and electronic device comprising the same30 Jun 2026US 12,672,240 B2LG Innotek Co., Ltd.
- Printed circuit board8 Oct 2026US 2026/0313787 A1Samsung Electro-Mechanics Co., Ltd.
- Photosensitive resin composition, resin film having pattern, method for producing resin film having pattern, and semiconductor circuit board24 Sep 2026US 2026/0292972 A1Jsr Corporation
- Circuit module, circuit board, electronic device, and package module10 Sep 2026US 2026/0271181 A1Lite-On Technology Corporation
- Substrate structure and power supply device3 Sep 2026US 2026/0262158 A1TDK Corporation
- High-voltage printed circuit board with integrated plasma discharge electrodes for scalable plasma-based water treatment systems13 Aug 2026US 2026/0239528 A1Black Spark Inc
Most cited
By later US patents
- Memory modules with voltage regulation and level translation94US 5,757,712 AInternational Business Machines Corporation · 1998
- Isolator with integral transformer51US 8,772,909 B1VLT, Inc. · 2014
- Methods and apparatus for optimizing structural layout of multi-circuit laminated composite assembly50US 8,785,784 B1Boulder Wind Power, Inc. · 2014
- Plugtype power supply unit43US 7,499,301 B2Tinyplug Technology (Shenzhen) · 2009
- Multi-chip modules with isolated coupling between modules40US 5,747,982 ALucent Technologies Inc. · 1998