Multi-chip modules with isolated coupling between modules

Abstract

A silicon-on-silicon dual MCM apparatus comprising a printed circuit board having a voltage isolation boundary contained therein supporting a pair of multi-chip modules on either side of the voltage isolation boundary. The MCMs safely convey signals across the isolation boundary via discrete optical coupling means or the like. The optical coupling means allow safe and efficient conveyance of signals across the voltage isolation boundary enabling a designer to group high voltage components on one side of the boundary and low voltage components on the other side of the boundary. This obviates to a degree the need for multi-layered PCBs. A relatively large number of passive components (resistors and capacitors) are integrated into a silicon substrate with flip-chip analog integrated circuits (ICs). Operational characteristics of the controller are verified after integration and are compared to the discrete version. High voltage isolation requirements, interference, and noise are all considered to determine the most critical portions of the dual MCM layout and design.

Dependencies are inferred from the claim text.