Back to results
US 12,672,233 B2Granted
Printed circuit board and manufacturing method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJun Ki Min, Seong Ho Choi
Life of this patent
Estimating the term…
Abstract
A printed circuit board according to an embodiment includes: an insulation layer including a recess portion; and a connection pad disposed on the recess portion of the insulation layer and protruded from the recess portion, wherein the connection pad may include a protrusion and a concave portion that is lower than the protrusion, and a surface height of the protrusion of the connection pad may be substantially the same as or less than a surface height of the insulation layer.
Claims9
A printed circuit board comprising:
- an insulation layer including a recess portion;
- and a connection pad disposed in the recess portion of the insulation layer and protruded from a bottom side of the recess portion, wherein the connection pad includes a protrusion and a concave portion that is lower than the protrusion, a surface height of the protrusion of the connection pad is less than a surface height of the insulation layer;
- wherein the connection pad is exposed in the cavity;
- wherein the protrusion of the connection pad is disposed in a center portion of the connection pad, and the concave portion surrounds the protrusion;
- and wherein a cross-section of the protrusion has a trapezoidal shape of which a width is narrowed as it goes upward.
2 more elements
Dependencies are inferred from the claim text.