H05B 1/0233
For semiconductors manufacturing
Official title: {for semiconductors manufacturing}
H05B1/0233 (For semiconductors manufacturing) appears on 305 US grants and 434 published applications in this corpus.
Search patents in H05B- Granted patents
- 305
- Published applications
- 434
- Assignees
- 116
- Inventors
- 824
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 2 |
| 2002 | 2 | 6 |
| 2003 | 2 | 2 |
| 2004 | 1 | 6 |
| 2005 | 5 | 1 |
| 2006 | 3 | 0 |
| 2007 | 0 | 6 |
| 2008 | 1 | 4 |
| 2009 | 1 | 2 |
| 2010 | 1 | 1 |
| 2011 | 2 | 2 |
| 2012 | 1 | 3 |
| 2013 | 1 | 18 |
| 2014 | 5 | 12 |
| 2015 | 11 | 11 |
| 2016 | 11 | 31 |
| 2017 | 17 | 29 |
| 2018 | 14 | 19 |
| 2019 | 24 | 18 |
| 2020 | 25 | 53 |
| 2021 | 15 | 43 |
| 2022 | 28 | 55 |
| 2023 | 35 | 35 |
| 2024 | 40 | 31 |
| 2025 | 40 | 23 |
| 2026 | 18 | 21 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Supporting unit and apparatus for treating substrate29 Sep 2026US 12,749,662 B2Semes Co., Ltd.
- Heater array and apparatus for processing a substrate including an heater array25 Aug 2026US 12,720,643 B2Semes Co., Ltd.
- Substrate holding unit and substrate processing apparatus11 Aug 2026US 12,703,917 B2Samsung Electronics Co., Ltd.
- Managing beam power effects by varying base emissivity28 Jul 2026US 12,695,048 B2APPLIED Materials.Inc.
- Method for controlling temperature of substrate support and inspection apparatus16 Jun 2026US 12,660,047 B2Tokyo Electron Limited
- Deposition system with integrated carrier cleaning modules17 Sep 2026US 2026/0275502 A1Veeco Instruments Inc.
- Deposition system with integrated carrier cleaning modules10 Sep 2026US 2026/0265903 A1Veeco Instruments Inc.
- Microwave-reactive micro-heater, method for device transfer and bonding using the same, and apparatus therefor13 Aug 2026US 2026/0239499 A1Electronics and Telecommunications Research Institute
- Substrate processing method, method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium13 Aug 2026US 2026/0239914 A1Kokusai Electric Corporation
- Methods and systems for reduction of thermal gradient across height of a vessel6 Aug 2026US 2026/0231296 A1ASM IP Holding B. V.
Most cited
By later US patents
- Heating plate with planar heating zones for semiconductor processing74US 8,637,794 B2Lam Research Corporation · 2014
- Heating plate with planar heater zones for semiconductor processing49US 8,884,194 B2Lam Research Corporation · 2014
- System and method for monitoring temperatures of and controlling multiplexed heater array46US 9,307,578 B2Lam Research Corporation · 2016
- Methods and apparatuses for deuterium recovery42US 9,257,314 B1Poongsan Corporation · 2016
- Thermal dynamic response sensing systems for heaters31US 10,163,668 B2Watlow Electric Manufacturing Company · 2018