Method for controlling temperature of substrate support and inspection apparatus

A method for controlling a temperature of a substrate support, on which a substrate is placed, during inspecting devices formed on the substrate,

• wherein a substrate placement surface of the substrate support is divided into multiple regions and a heater is disposed in each of the multiple regions, and
• the devices are inspected either one by one or in groups of a few devices by supplying power to the device(s) under inspection,
• the method comprising:
• performing feed-back control of the heater in a main region that overlaps with a center of an inspection target device in plan view among the multiple regions such that a temperature of the main region becomes a set temperature;
• and
• controlling the heater in each sub-region adjacent to the main region among the multiple regions,
• wherein in said controlling the heater in each sub-region,
• when overshoot has not occurred in the temperature of the main region, the heater in the sub-region is controlled such that a temperature difference between the main region and the sub-region becomes an offset amount, wherein the offset amount is set to prevent a heat inflow from the sub-region to the main region and warpage of the substrate placement surface, and
• when overshoot has occurred in the temperature of the main region, the heater in the sub-region is controlled such that a temperature difference between the set temperature and the temperature in the sub-region becomes the offset amount,
• wherein whether or not the overshoot has occurred in the temperature of the main region is determined based on whether or not the temperature of the main region exceeds a reference temperature that is set to be higher than the set temperature,
• wherein the substrate support has temperature sensors in each of the regions,
• the method further comprising:
• acquiring, as the temperature of the main region, a temperature of a portion of the main region where the inspection target device is disposed,
• wherein in said acquiring, the temperature of the portion of the main region where the inspection target device is disposed is acquired based on measurement results of the temperature sensors around the inspection target device and weightings corresponding to distances between the temperature sensors and the inspection target device.