Deposition system with integrated carrier cleaning modules

Abstract

A chemical vapor deposition system for semiconductor wafer production is provided and includes a first transfer chamber and a first equipment front end module (EFEM) operably coupled to the first transfer chamber. The first EFEM is configured to load and unload one or more wafers from one or more wafer carriers. A first process cluster is operably coupled to the first transfer chamber. The first process cluster comprises one or more processing modules that surround the first transfer chamber. The system includes one or more wafer carrier cleaning modules directly coupled to the first transfer chamber and contained within the first process cluster. The one or more wafer cleaning modules are configured to automatically clean the one or more wafer carriers.

Dependencies are inferred from the claim text.