H03H 9/02102
Of temperature influence
Official title: {of temperature influence (cutting angles H03H9/02015)}
H03H9/02102 (Of temperature influence) appears on 481 US grants and 603 published applications in this corpus.
Search patents in H03H- Granted patents
- 481
- Published applications
- 603
- Assignees
- 133
- Inventors
- 796
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 3 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 4 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 2 | 1 |
| 2003 | 0 | 0 |
| 2004 | 0 | 5 |
| 2005 | 1 | 16 |
| 2006 | 5 | 6 |
| 2007 | 5 | 6 |
| 2008 | 13 | 4 |
| 2009 | 7 | 6 |
| 2010 | 1 | 11 |
| 2011 | 12 | 10 |
| 2012 | 9 | 14 |
| 2013 | 9 | 20 |
| 2014 | 11 | 23 |
| 2015 | 16 | 20 |
| 2016 | 22 | 21 |
| 2017 | 23 | 20 |
| 2018 | 18 | 26 |
| 2019 | 25 | 44 |
| 2020 | 32 | 38 |
| 2021 | 41 | 48 |
| 2022 | 38 | 73 |
| 2023 | 40 | 66 |
| 2024 | 54 | 50 |
| 2025 | 45 | 46 |
| 2026 | 30 | 29 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Die package with sealed die enclosures15 Sep 2026US 12,738,918 B2QUALCOMM Incorporated
- Acoustic wave device15 Sep 2026US 12,738,919 B2Murata Manufacturing Co., Ltd.
- Acoustic wave device8 Sep 2026US 12,732,153 B2Murata Manufacturing Co., Ltd.
- Laterally excited bulk acoustic wave device with thermally conductive layer25 Aug 2026US 12,719,438 B2Skyworks Solutions, Inc.
- Packaged acoustic wave devices with multilayer piezoelectric substrate18 Aug 2026US 12,712,519 B2Skyworks Solutions, Inc.
- Stress isolated bulk acoustic wave resonator dies1 Oct 2026US 2026/0303056 A1
- Laterally-excited bulk acoustic wave resonator and filter device including the same3 Sep 2026US 2026/0261253 A1Murata Manufacturing Co., Ltd.
- Bulk acoustic wave resonator, fabrication method thereof, and electronic device20 Aug 2026US 2026/0246442 A1Beijing BOE Technology Development Co., Ltd.
- Acoustic resonator and manufacturing method therefor20 Aug 2026US 2026/0246445 A1University of Science and Technology of China
- Stacked structure with multiple acoustic wave devices6 Aug 2026US 2026/0230057 A1Skyworks Solutions, Inc.
Most cited
By later US patents
- Encapsulated electronics device with improved heat dissipation310US 6,992,400 B2Epcos AG · 2006
- Transversely-excited film bulk acoustic resonator276US 10,491,192 B1Resonant Inc. · 2019
- Piezoelectric composite thin film resonator190US 4,456,850 ANippon Electric Co., Ltd. · 1984
- Bandpass filter with frequency separation between shunt and series resonators set by dielectric layer thickness164US 10,917,070 B2Resonant Inc. · 2021
- Method of manufacturing a mechanical resonating structure162US 9,762,202 B2Analog Devices, Inc. · 2017