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US 12,719,438 B2Granted
Laterally excited bulk acoustic wave device with thermally conductive layer
AssigneeSkyworks Solutions, Inc.
InventorsRei Goto, Hironori Fukuhara
Life of this patent
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Abstract
An acoustic wave device is disclosed. The acoustic wave device can include a piezoelectric layer, an interdigital transducer electrode on a first side of the piezoelectric layer, an air cavity on a second side of the piezoelectric layer that is opposite to the first side of the piezoelectric layer, and a thermally conductive layer. The acoustic wave device is configured to laterally excite a bulk acoustic wave. The thermally conductive layer is configured to dissipate heat associated with exciting the laterally excited bulk acoustic wave.
Claims20
An acoustic wave device comprising:
- a piezoelectric layer;
- an interdigital transducer electrode on a first side of the piezoelectric layer;
- an air cavity on a second side of the piezoelectric layer that is opposite to the first side of the piezoelectric layer;
- a support substrate on the second side of the piezoelectric layer;
- and
- a thermally conductive layer having a thermal conductivity of at least 100 W/(K*m), the thermally conductive layer including at least one of semiconductor or non-electrically conductive material, the acoustic wave device configured to laterally excite a bulk acoustic wave, the thermally conductive layer extending along a surface of the support substrate facing the air cavity, the thermally conductive layer also extending such that the support substrate is positioned between a portion of the thermally conductive layer and the piezoelectric layer, and the thermally conductive layer configured to dissipate heat associated with exciting the laterally excited bulk acoustic wave.
3 more elements
A laterally excited bulk acoustic wave device comprising:
- a support substrate;
- a piezoelectric layer over the support substrate;
- an interdigital transducer electrode over the piezoelectric layer, the interdigital transducer electrode having a duty factor of 0.4 or less;
- signal lines over the piezoelectric layer;
- an air cavity at least partially between the piezoelectric layer and the support substrate;
- a thermally conductive layer over the piezoelectric layer and at least a portion of the signal lines, the thermally conductive layer being in thermal communication with the piezoelectric layer and having a thermal conductivity greater than the piezoelectric layer, the thermal conductivity of the thermally conductive layer being at least 100 W/(K*m), and the thermally conductive layer including at least one of semiconductor or non-electrically conductive material, the thermally conductive layer disposed such that the interdigital transducer electrode is positioned closer to the thermally conductive layer than to the support substrate;
- and
- a second thermally conductive layer extending along a surface of the support substrate facing the air cavity, the second thermally conductive layer also extending such that they support substrate is positioned between a portion of the second thermally conductive layer and the piezoelectric layer, the second thermally conductive layer being in thermal communication with the piezoelectric layer and having a thermal conductivity greater than the piezoelectric layer, and the laterally excited bulk acoustic wave device configured to laterally excite a bulk acoustic wave.
5 more elements
An acoustic wave filter for radio frequency filtering, the acoustic wave filter comprising:
- an acoustic wave resonator including a piezoelectric layer, an interdigital transducer electrode on a first side of the piezoelectric layer, an air cavity on a second side of the piezoelectric layer that is opposite to the first side of the piezoelectric layer, a support substrate on the second side of the piezoelectric layer, and a thermally conductive layer configured to dissipate heat associated with the acoustic wave resonator generating a laterally excited bulk acoustic wave, the thermally conductive layer having a thermal conductivity of at least 100 W/(K*m), the thermally conductive layer extending along a surface of the support substrate facing the air cavity, the thermally conductive layer including at least one of semiconductor or non-electrically conductive material, and the thermally conductive layer also extending such that the support substrate is positioned between a portion of the thermally conductive layer and the piezoelectric layer;
- and
- a plurality of additional acoustic wave resonators, the acoustic wave resonator and the plurality of additional acoustic wave resonators together configured to filter a radio frequency signal.
Dependencies are inferred from the claim text.