H01S 5/02218
Material of the housings
Official title: Material of the housings; Filling of the housings
H01S5/02218 (Material of the housings) appears on 495 US grants and 630 published applications in this corpus.
Search patents in H01S- Granted patents
- 495
- Published applications
- 630
- Assignees
- 224
- Inventors
- 1,271
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 3 | 0 |
| 1992 | 2 | 0 |
| 1993 | 7 | 0 |
| 1994 | 4 | 0 |
| 1995 | 6 | 0 |
| 1996 | 7 | 0 |
| 1997 | 2 | 0 |
| 1998 | 11 | 0 |
| 1999 | 6 | 0 |
| 2000 | 3 | 0 |
| 2001 | 6 | 3 |
| 2002 | 4 | 13 |
| 2003 | 9 | 22 |
| 2004 | 20 | 16 |
| 2005 | 19 | 24 |
| 2006 | 11 | 13 |
| 2007 | 10 | 20 |
| 2008 | 11 | 11 |
| 2009 | 10 | 12 |
| 2010 | 19 | 6 |
| 2011 | 4 | 10 |
| 2012 | 3 | 13 |
| 2013 | 6 | 13 |
| 2014 | 12 | 17 |
| 2015 | 15 | 14 |
| 2016 | 14 | 23 |
| 2017 | 19 | 19 |
| 2018 | 14 | 21 |
| 2019 | 29 | 59 |
| 2020 | 32 | 51 |
| 2021 | 32 | 55 |
| 2022 | 30 | 58 |
| 2023 | 28 | 48 |
| 2024 | 29 | 45 |
| 2025 | 29 | 31 |
| 2026 | 23 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Light emitting device18 Aug 2026US 12,712,331 B2Nichia Corporation
- External resonant laser module and method of manufacturing external resonant laser module11 Aug 2026US 12,706,435 B2Hamamatsu Photonics K.K.
- Optical device11 Aug 2026US 12,706,443 B2Ricoh Company, Ltd.
- Optical integrated circuit sensor package using a stacked configuration for the sensor die and the emitter die23 Jun 2026US 12,665,385 B2Stmicroelectronics Pte Ltd
- Laser integration techniques9 Jun 2026US 12,651,885 B2Apple Inc.
- Header for semiconductor package27 Aug 2026US 2026/0254192 A1Shinko Electric Industries Co., Ltd.
- Optical fiber device, method for manufacturing optical fiber device, and laser device20 Aug 2026US 2026/0246227 A1Shimadzu Corporation
- Semiconductor laser device30 Jul 2026US 2026/0221715 A1ams-OSRAM International GmbH
- Package structure, optical module, and optical communication device16 Jul 2026US 2026/0202631 A1Huawei Technologies Co., Ltd.
- Multichip Module9 Jul 2026US 2026/0196801 A1NTT, Inc.
Most cited
By later US patents
- Method for encapsulating light emitting diodes182US 5,516,727 AInternational Business Machines Corporation · 1996
- Multiwavelength actively mode-locked external cavity semiconductor laser111US 6,192,058 B1Sarnoff Corporation · 2001
- Device package and method for the fabrication and testing thereof75US 7,129,163 B2Rohm and Haas Electronic Materials LLC · 2006
- Vertical-cavity surface emitting laser optical interconnect technology74US 5,266,794 ABandgap Technology Corporation · 1993
- Optical module having a vertical-cavity surface-emitting laser71US 5,796,714 AMatsushita Electric Industrial Co., Ltd. · 1998