Package structure, optical module, and optical communication device

An optical module, comprising:

• an electrical chip configured to generate an electrical signal carrying data;
• and
• a package structure, comprising:
• a can, provided with a transparent window, the package structure being a transistor outline package structure;
• a header, mated with the can to form a cavity structure;
• and
• a horizontal cavity surface-emitting laser (HCSEL) chip, disposed in the cavity structure,
• wherein a plane in which the HCSEL chip is located is parallel to a mounting surface of the header, and an optical signal emitted by the HCSEL chip is directed toward the transparent window, wherein
• a detection unit is disposed in the HCSEL chip;
• and configured to detect a power of the optical signal emitted by the HCSEL chip, the HCSEL chip being configured to generate an optical signal based on the electrical signal.

An optical communication device, comprising:

• N boards, wherein each board of the N boards comprises one or more optical modules, each optical module of the one or more optical modules comprising:
• an electrical chip configured to generate an electrical signal carrying data;
• and
• a package structure,
• comprising:
• a can, provided with a transparent window, the package structure being a transistor outline package structure;
• a header, mated with the can to form a cavity structure;
• and
• a horizontal cavity surface-emitting laser (HCSEL) chip, disposed in the cavity structure, wherein a plane in which the HCSEL chip is located is parallel to a mounting surface of the header, and an optical signal emitted by the HCSEL chip is directed toward the transparent window, wherein
• a detection unit is disposed in the HCSEL chip, and the detection unit is configured to detect power of the optical signal emitted by the HCSEL chip, the HCSEL chip being configured to generate an optical signal based on the electrical signal.