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US 12,665,385 B2Granted
Optical integrated circuit sensor package using a stacked configuration for the sensor die and the emitter die
AssigneeStmicroelectronics Pte Ltd
InventorLoic Pierre Louis Renard
Life of this patent
Estimating the term…
Abstract
An optical sensor package includes an emitter die mounted to an upper surface of a package substrate. A sensor die is mounted to the upper surface of the package substrate using a film on die (FOD) adhesive layer that extends over the upper surface and encapsulates the emitter die. The sensor die is positioned in a stacked relationship with respect to the emitter die such that a light channel region which extends through the sensor die is optically aligned with the emitter die. Light emitted by the emitter die passes through the light channel region of the sensor die. The emitter die and the sensor die are each electrically coupled to the package substrate.
Claims25
An optical sensor package, comprising:
- a package substrate;
- an emitter die having a back surface mounted to an upper surface of the package substrate;
- an adhesive layer extending over the upper surface and encapsulating the emitter die on its side and front surfaces, wherein the adhesive layer includes a portion overlying the emitter die;
- a sensor die mounted to an upper surface of the adhesive layer in a stacked relationship where the sensor die is positioned to cover over the portion of the adhesive layer overlying the emitter die;
- said sensor die including a light channel region that extends through a thickness of the sensor die and which is optically aligned with the emitter die such that light emitted by the emitter die passes through the light channel region of the sensor die;
- and
- electrical connections between the package substrate and each of the emitter die and the sensor die.
4 more elements
An optical sensor package, comprising:
- a package substrate;
- an emitter die mounted to an upper surface of the package substrate;
- an adhesive layer extending over the upper surface and encapsulating the emitter die;
- a sensor die mounted to an upper surface of the adhesive layer in a stacked relationship where the sensor die is positioned to cover over the emitter die;
- said sensor die including a light channel region that extends through a thickness of the sensor die and which is optically aligned with the emitter die such that light emitted by the emitter die passes through the light channel region of the sensor die;
- and
- electrical connections between the package substrate and each of the emitter die and the sensor die;
- and
- wherein the sensor die includes a semiconductor substrate and wherein the light channel region is at least partially delimited by a region of the semiconductor substrate having a different native doping concentration level than another region within which active integrated circuits are fabricated.
6 more elements
An optical sensor package, comprising:
- a package substrate;
- an emitter die mounted to an upper surface of the package substrate;
- an adhesive layer extending over the upper surface and encapsulating the emitter die;
- a sensor die mounted to an upper surface of the adhesive layer in a stacked relationship where the sensor die is positioned to cover over the emitter die;
- said sensor die including a light channel region that extends through a thickness of the sensor die and which is optically aligned with the emitter die such that light emitted by the emitter die passes through the light channel region of the sensor die;
- and
- electrical connections between the package substrate and each of the emitter die and the sensor die;
- wherein said sensor die comprises:
- a semiconductor substrate;
- and
- an interconnect layer extending over the semiconductor substrate;
- and
- wherein the light channel region extends through a first portion of the semiconductor substrate and a first portion of the interconnect layer from a back side of the sensor die to a front side of the sensor die.
10 more elements
An apparatus, comprising:
- a substrate;
- a first integrated circuit die mounted to an upper surface of the substrate;
- a film on die (FOD) structure providing a die attach film layer extending over the upper surface and completely encapsulating the first integrated circuit die;
- a second integrated circuit die mounted to an upper surface of the FOD structure in a stacked relationship where the second integrated circuit die is positioned to cover over the first integrated circuit die;
- and
- electrical connections between the substrate and each of the first and second integrated circuit dies.
3 more elements
An apparatus, comprising:
- a substrate;
- a first integrated circuit die mounted to an upper surface of the substrate;
- an adhesive film layer extending over the upper surface and encapsulating the first integrated circuit die;
- a second integrated circuit die mounted to an upper surface of the adhesive film layer in a stacked relationship where the second integrated circuit die is positioned to cover over the first integrated circuit die;
- and
- electrical connections between the substrate and each of the first and second integrated circuit dies;
- wherein said first integrated circuit die includes a light emitter configured to emit a beam of light that passes through a light channel region that extends through a thickness of the second integrated circuit die, and wherein the second integrated circuit die includes a light sensor configured to sense the emitter beam of light;
- and
- wherein said second integrated circuit die comprises:
- a semiconductor substrate;
- and
- an interconnect layer extending over the semiconductor substrate;
- and
- wherein the light channel region extends through a first portion of the semiconductor substrate and a first portion of the interconnect layer from a back side of the second integrated circuit die to a front side of the second integrated circuit die.
11 more elements
Dependencies are inferred from the claim text.