H01S 5/02232
Liquid-filled housings
H01S5/02232 (Liquid-filled housings) appears on 11 US grants and 12 published applications in this corpus.
Search patents in H01S- Granted patents
- 11
- Published applications
- 12
- Assignees
- 9
- Inventors
- 30
- Latest grant
- 27 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 1 | 1 |
| 2006 | 0 | 1 |
| 2007 | 0 | 1 |
| 2008 | 0 | 1 |
| 2009 | 0 | 1 |
| 2010 | 3 | 0 |
| 2011 | 1 | 1 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 1 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 2 |
| 2018 | 0 | 0 |
| 2019 | 1 | 1 |
| 2020 | 0 | 0 |
| 2021 | 1 | 1 |
| 2022 | 0 | 0 |
| 2023 | 0 | 2 |
| 2024 | 0 | 0 |
| 2025 | 0 | 0 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Apparatus for monitoring fluid27 Jan 2026US 12,535,428 B2Electronics and Telecommunications Research Institute
- Semiconductor continuous array layer11 May 2021US 11,005,018 B2
- Methods of filling a flowable material in a gap of an assembly module1 Jan 2019US 10,170,671 B2
- Reducing thermal expansion effects in semiconductor packages19 Aug 2014US 8,809,125 B2Finisar Corporation
- Reducing thermal expansion effects in semiconductor packages31 May 2011US 7,952,108 B2Finisar Corporation
- Apparatus for monitoring fluid7 Sep 2023US 2023/0280278 A1Electronics and Telecommunications Research Institute
- Semiconductor continuous array layer30 Mar 2023US 2023/0101190 A1
- Semiconductor continuous array layer2 Sep 2021US 2021/0273146 A1
- Semiconductor continuous array layer28 Mar 2019US 2019/0097103 A1
- Methods of filling an organic or inorganic liquid in an assembly module21 Dec 2017US 2017/0365755 A1
Most cited
By later US patents
- Semiconductor laser with COD preventing disordered regions27US 5,469,457 AMitsubishi Denki Kabushiki Kaisha · 1995
- Laser diode package16US 5,262,675 ACray Research, Inc. · 1993
- Methods of filling a flowable material in a gap of an assembly module4US 10,170,671 B22019
- Semiconductor laser device, and image display device4US 7,680,171 B2Panasonic Corporation · 2010
- Semiconductor laser device, optical transmission device, optical transmission system, electronic device, control device, connector, communication device, and optical transmission method and data transmission and reception method3US 6,888,864 B1Sharp Kabushiki Kaisha · 2005