Reducing thermal expansion effects in semiconductor packages

An electronic device comprising:

• a support;
• an electronic component supported by the support;
• a first layer substantially encasing, and in direct physical contact with, all exposed surfaces of the electronic component;
• and
• a second layer substantially encasing, and in direct physical contact with, all exposed surfaces of the first layer, the second layer also substantially encasing, and in direct physical contact with, all exposed surfaces of that portion of the support that is supporting the electronic component,
• wherein the first layer comprises a first material that does not have any filler particles embedded therein and that is more flexible than the second layer thereby creating a mechanical buffer layer between the second layer and the electronic component such that the electronic component is protected from thermal expansion of the second portion caused by changes in temperature, the second layer comprises a second material having filler particles embedded therein, the filler particles have different thermal expansion characteristics than the first material for reducing overall expansion of the second layer in response to increase in temperature, the filler particles have a modulus of elasticity that is different from the first material, and the filler particles cause scattering of an optical signal transmitted through the second layer.