Optical module having a vertical-cavity surface-emitting laser

An optical module comprising:

• a first substrate;
• a vertical-cavity surface-emitting laser comprising an upper surface, a bottom surface and a semiconductor multi-layered structure including at least a light-emitting layer, the vertical-cavity surface-emitting laser being supported on the first substrate;
• an electrode structure provided at a different position in the vicinity of the vertical-cavity surface-emitting laser, the electrode structure being electrically connected with the bottom surface of the adjacent vertical-cavity surface-emitting laser for realizing carrier injection between vertical-cavity surface-emitting laser and the electrode structure adjacent thereto, and the electrode structure being supported on the first substrate;
• a first supporting structure comprising a conductive upper surface, the first supporting structure being supported on the first substrate;
• a first line for electrically connecting the upper surface of the vertical-cavity surface-emitting laser and the first supporting structure;
• and
• a second substrate comprising a first bump and a second bump,
• wherein an upper surface of the electrode structure and the upper surface of the first supporting structure jut out from the first substrate, and the second substrate is positioned with respect to the first substrate so that the first bump and the second bump come into contact with the upper surface of the electrode structure and the upper surface of the first supporting structure, respectively, and
• wherein the vertical-cavity surface-emitting laser, the electrode structure and the first supporting structure are positioned at different positions from each other on the first substrate, respectively.

An optical module comprising:

• a first substrate;
• a vertical-cavity surface-emitting laser comprising an upper surface, a bottom surface which is in contact with the first substrate, and a semiconductor multi-layered structure including at least a light-emitting layer, the vertical-cavity surface-emitting laser being supported on the first substrate;
• a bipolar transistor formed on the upper surface of the vertical-cavity surface-emitting laser;
• an electrode structure provided at a different position in the vicinity of the vertical-cavity surface-emitting laser, the electrode structure being electrically connected with the bottom surface of the adjacent vertical-cavity surface-emitting laser for realizing carrier injection between vertical-cavity surface-emitting laser and the electrode structure adjacent thereto, and the electrode structure being supported on the first substrate;
• and
• a second substrate comprising a first bump and a second bump,
• wherein an upper surface of the electrode structure juts out from the first substrate, and the second substrate is positioned with respect to the first substrate so that the first bump and the second bump come into contact with the upper surface of the electrode structure and an upper surface of the bipolar transistor, respectively, and
• each of the first bump and the second bump is made of a material which respectively accomplishes electrical bonding between the first bump and the electrode structure and electrical bonding between the second bump and the vertical-cavity surface-emitting laser without involving melting of the first bump and the second bump.

An optical module comprising:

• a first substrate;
• a vertical-cavity surface-emitting laser comprising an upper surface, a bottom surface and a semiconductor multi-layered structure including at least a light-emitting layer, the vertical-cavity surface-emitting laser being supported on the first substrate;
• a bipolar transistor formed on the upper surface of the vertical-cavity surface-emitting laser;
• an electrode structure provided at a different position in the vicinity of the vertical-cavity surface-emitting laser, the electrode structure being electrically connected with the bottom surface of the adjacent vertical-cavity surface-emitting laser for realizing carrier injection between vertical-cavity surface-emitting laser and the electrode structure adjacent thereto, and the electrode structure being supported on the first substrate;
• and
• a first supporting structure comprising a conductive upper surface, the first supporting structure being supported on the first substrate;
• a first line for electrically connecting the bipolar transistor and the upper surface of the first supporting structure;
• and
• a second substrate comprising a first bump and a second bump,
• wherein an upper surface of the electrode structure and the upper surface of the first supporting structure jut out from the first substrate, and the second substrate is positioned with respect to the first substrate so that the first bump and the second bump come into contact with the upper surface of the electrode structure and the upper surface of the first supporting structure, respectively, and
• wherein the vertical-cavity surface-emitting laser, the electrode structure and the first supporting structure are positioned at different positions from each other on the first substrate, respectively.

An optical module comprising:

• a first substrate;
• a vertical-cavity surface-emitting laser comprising an upper surface, a bottom surface and a semiconductor multi-layered structure including at least a light-emitting layer, the vertical-cavity surface-emitting laser being supported on the first substrate;
• an electrode structure provided at a different position in the vicinity of the vertical-cavity surface-emitting laser, the electrode structure being electrically connected with the bottom surface of the adjacent vertical-cavity surface-emitting laser for realizing carrier injection between vertical-cavity surface-emitting laser and the electrode structure adjacent thereto, and the electrode structure being supported on the first substrate;
• and
• a second substrate comprising a first bump and a second bump,
• wherein an upper surface of the electrode structure and the upper surface of the vertical-cavity surface-emitting laser jut out from the first substrate, and the second substrate is positioned with respect to the first substrate so that the first bump and the second bump come into contact with the upper surface of the electrode structure and the upper surface of the vertical-cavity surface-emitting laser, respectively, and
• wherein each of the first bump and the second bump is made of a constituent material which accomplishes bonding of the first substrate with the second substrate through formation of an alloy of the constituent material.