Multichip Module
AssigneeNTT, Inc.
InventorsKiyofumi Kikuchi, Ken Tsuzuki, Takashi Yamada, Masayuki Takahashi
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Abstract
Provided is a multi-chip optical module in which a plurality of IC chips mounted on one substrate are packaged, the multi-chip optical module including: a lid component that forms an accommodation space for accommodating the plurality of IC chips together with the substrate and has protrusions protruding toward each of the IC chips; and adhesive layers formed between the protrusions and the IC chips, in which protrusion lengths of the protrusions vary according to heights of the protrusions with respect to the substrate.
Claims8
A multichip module in which a plurality of chip components mounted on one substrate are packaged, the multichip module comprising:
- a lid component that forms an accommodation space for accommodating the plurality of chip components together with the substrate and has protrusions protruding toward each of the chip components;
- and
- first adhesive layers formed between the protrusions and the chip components,
- wherein protrusion lengths of the protrusions vary according to heights of the chip components with respect to the substrate.
Dependencies are inferred from the claim text.