Header for semiconductor package
AssigneeShinko Electric Industries Co., Ltd.
InventorsTakaharu MIYAMOTO, Akihisa WATANABE
Life of this patent
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Abstract
A header for a semiconductor package includes a first eyelet provided with a first through hole, a second eyelet bonded on the first eyelet and provided with a second through hole communicating with the first through hole, a lead inserted into the first through hole and the second through hole, and a sealing material that seals the lead inside the first through hole. An opening area of the second through hole is smaller than an opening area of the first through hole in a plan view, and a dielectric constant in a periphery of the lead inside the second through hole is smaller than a dielectric constant of the sealing material.
Claims10
A header for a semiconductor package, comprising:
- a first eyelet provided with a first through hole;
- a second eyelet bonded on the first eyelet and provided with a second through hole communicating with the first through hole;
- a first lead inserted into the first through hole and the second through hole;
- and
- a first sealing material that seals the first lead inside the first through hole, wherein:
- an opening area of the second through hole is smaller than an opening area of the first through hole in a plan view, and
- a dielectric constant in a periphery of the first lead inside the second through hole is smaller than a dielectric constant of the first sealing material.
Dependencies are inferred from the claim text.