H01S 5/02234
Resin-filled housings
Official title: Resin-filled housings; the housings being made of resin
H01S5/02234 (Resin-filled housings) appears on 220 US grants and 250 published applications in this corpus.
Search patents in H01S- Granted patents
- 220
- Published applications
- 250
- Assignees
- 123
- Inventors
- 596
- Latest grant
- 9 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 5 | 0 |
| 1994 | 4 | 0 |
| 1995 | 4 | 0 |
| 1996 | 5 | 0 |
| 1997 | 1 | 0 |
| 1998 | 9 | 0 |
| 1999 | 6 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 1 |
| 2002 | 3 | 8 |
| 2003 | 5 | 9 |
| 2004 | 10 | 6 |
| 2005 | 12 | 13 |
| 2006 | 5 | 5 |
| 2007 | 3 | 8 |
| 2008 | 3 | 5 |
| 2009 | 6 | 5 |
| 2010 | 7 | 3 |
| 2011 | 1 | 3 |
| 2012 | 1 | 6 |
| 2013 | 4 | 6 |
| 2014 | 6 | 6 |
| 2015 | 5 | 6 |
| 2016 | 4 | 7 |
| 2017 | 5 | 4 |
| 2018 | 5 | 12 |
| 2019 | 10 | 16 |
| 2020 | 16 | 29 |
| 2021 | 16 | 21 |
| 2022 | 15 | 17 |
| 2023 | 12 | 17 |
| 2024 | 11 | 19 |
| 2025 | 4 | 14 |
| 2026 | 9 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Optical fiber device, method for manufacturing optical fiber device, and laser device20 Aug 2026US 2026/0246227 A1Shimadzu Corporation
- Package structure, optical module, and optical communication device16 Jul 2026US 2026/0202631 A1Huawei Technologies Co., Ltd.
- Transmitting secret key and/or artificial noise buffer status reports7 May 2026US 2026/0129432 A1QUALCOMM Incorporated
- Semiconductor light-emitting device5 Mar 2026US 2026/0068348 A1Rohm Co., Ltd.
- Optoelectronic module and method for producing an optoelectronic module31 Jul 2025US 2025/0246873 A1ams-OSRAM International GmbH
Most cited
By later US patents
- Method for encapsulating light emitting diodes182US 5,516,727 AInternational Business Machines Corporation · 1996
- Vertical-cavity surface emitting laser optical interconnect technology74US 5,266,794 ABandgap Technology Corporation · 1993
- Optical module having a vertical-cavity surface-emitting laser71US 5,796,714 AMatsushita Electric Industrial Co., Ltd. · 1998
- Transferring semiconductor crystal from a substrate to a resin61US 7,009,220 B2Sony Corporation · 2006
- Laser-based controlled-intensity light source using reflection from a convex surface and method of making same47US 5,835,514 AHewlett-Packard Company · 1998