Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component

A method for producing an optoelectronic semiconductor component, the method comprising:

• providing a lead frame having a first mounting surface;
• forming a molded body to the lead frame such that an alignment surface is formed transverse to the first mounting surface;
• mounting a semiconductor chip on the first mounting surface;
• and
• arranging an optical element on the alignment surface, wherein the alignment surface is brought into direct contact with the optical element and the optical element is aligned with respect to the semiconductor chip based on the alignment surface, and
• wherein the optical element is brought in direct contact with an emission surface, or
• wherein the optical element is brought in direct contact with the first mounting surface and wherein a radiation-transmissive encapsulation compound is arranged between the emission surface and the optical element.

An optoelectronic semiconductor component comprising:

• a lead frame having a first mounting surface;
• a semiconductor chip arranged on the first mounting surface and having an emission surface;
• an optical element;
• and
• a molded body,
• wherein the optical element has an input-coupling surface oriented transverse to the first mounting surface,
• wherein the semiconductor chip is configured to emit electromagnetic radiation through the emission surface, a radiation axis of which being parallel to the first mounting surface,
• wherein the optical element is configured to deflect the electromagnetic radiation of the semiconductor chip coupled in via the input-coupling surface,
• wherein the molded body is arranged at the lead frame and has an alignment surface transverse to the first mounting surface,
• wherein the optical element and the alignment surface are in direct contact with each other, and
• wherein the optical element is in direct contact with the emission surface, or
• wherein the optical element is in direct contact with the first mounting surface and a radiation-transmissive encapsulation compound is arranged between the emission surface and the optical element.