H01J 2237/31791
Scattering mask
H01J2237/31791 (Scattering mask) appears on 21 US grants and 10 published applications in this corpus.
Search patents in H01J- Granted patents
- 21
- Published applications
- 10
- Assignees
- 11
- Inventors
- 24
- Latest grant
- 22 May 2007
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 1 |
| 2002 | 4 | 5 |
| 2003 | 3 | 0 |
| 2004 | 3 | 2 |
| 2005 | 0 | 1 |
| 2006 | 2 | 0 |
| 2007 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Mask-making member and its production method, mask and its making method, exposure process, and fabrication method of semiconductor device22 May 2007US 7,220,975 B2Sony Corporation
- Mask-making member and its production method, mask and its making method, exposure process, and fabrication method of semiconductor device24 Oct 2006US 7,126,231 B2Sony Corporation
- Mask-making member and its production method, mask and its making method, exposure process, and fabrication method of semiconductor device5 Sep 2006US 7,102,243 B2Sony Corporation
- Scattering-reticle assemblies for electron-beam microlithography including a scattering-stencil reticle portion and a scattering-membrane reticle portion27 Jul 2004US 6,767,691 B2Nikon Corporation
- Charged-particle-beam microlithography methods exhibiting reduced coulomb effects29 Jun 2004US 6,756,182 B2Nikon Corporation
- Mask-making member and its production method, mask and its making method, exposure process, and fabrication method of semiconductor device24 May 2007US 2007/0114450 A1
- Mask-making member and its production method, mask and its making method, exposure process, and fabrication method of semiconductor device11 Aug 2005US 2005/0174553 A1Sony Corporation
- Mask-making member and its production method, mask and its making method, exposure process, and fabrication method of semiconductor device20 May 2004US 2004/0096755 A1Sony Corporation
- Scattering-reticle assemblies for electron-beam microlithography including a scattering-stencil reticle portion and a scattering-membrane reticle portion29 Apr 2004US 2004/0081916 A1Nikon Corporation
- Charged-particle-beam microlithography methods exhibiting reduced coulomb effects12 Dec 2002US 2002/0187411 A1Nikon Corporation
Most cited
By later US patents
- Device manufacture involving step-and-scan delineation79US 5,260,151 AAT&T Bell Laboratories · 1993
- Device manufacture involving lithographic processing54US 5,079,112 AAT&T Bell Laboratories · 1992
- Device manufacture involving lithographic processing47US 5,130,213 AAT&T Bell Laboratories · 1992
- Device manufacture involving lithographic processing36US 5,258,246 AAT&T Bell Laboratories · 1993
- Method of processing a substrate utilizing specific chuck26US 5,989,760 AMotorola, Inc. · 1999