Back to results
US 5,989,760 AGranted
Method of processing a substrate utilizing specific chuck
AssigneeMotorola, Inc.
InventorsPawitter Jit Singh Mangat, William Joseph Dauksher
Life of this patent
Estimating the term…
Abstract
A substrate (10) having a central region (32) and a peripheral region (34) is processed using a chuck (40) that contacts peripheral regions (34) of the substrate but not the central region. A fabrication step is performed while the substrate (10) is on the chuck (40, 60, 70). The chuck can be used in the formation of a lithographic mask or a semiconductor device.
Claims20
A method for processing a substrate comprising the steps of:
- placing the substrate on a chuck, wherein:
- the substrate has an edge, a central region, and a peripheral region;
- the peripheral region lies closer to the edge compared to the central region;
- the chuck includes at least one substrate holder, wherein each of the at least one substrate holder consists of a single piece;
- the substrate holder contacts the peripheral region of the substrate but not the central region;
- the substrate contacts only those portions of the chuck that include the at least one substrate holder consisting of a single piece;
- and
- performing a fabrication step using the substrate, wherein this step is performed while the substrate is on the substrate chuck.
5 more elements
A method of processing a semiconductor device substrate comprising the steps of:
- placing the semiconductor device substrate into a lithography tool having a mask, wherein the semiconductor device substrate has a resist layer;
- aligning the semiconductor device substrate to the mask by moving at least one of the semiconductor device substrate and the mask relative to each other, wherein:
- the at least one of the semiconductor device substrate and the mask has an edge, a central region, and a peripheral region that lies closer the edge compared to the central region;
- a position of the at least one of the semiconductor device substrate and the mask is controlled using a chuck, wherein the chuck includes at least one holder, and wherein each of the at least one holder consists of a single piece;
- the chuck contacts the peripheral region but does not contact the central region of the at least one of the semiconductor device substrate and the mask;
- the at least one of the semiconductor device substrate and the mask contacts only those portions of the chuck that include the at least one holder consisting of a single piece;
- and
- selectively exposing the resist layer using the mask;
- and
- removing the semiconductor device substrate from the lithography tool after the step of selectively exposing.
7 more elements
Dependencies are inferred from the claim text.