H01J 2237/2001
Maintaining constant desired temperature
H01J2237/2001 (Maintaining constant desired temperature) appears on 633 US grants and 785 published applications in this corpus.
Search patents in H01J- Granted patents
- 633
- Published applications
- 785
- Assignees
- 259
- Inventors
- 1,783
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 4 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 3 | 0 |
| 1993 | 10 | 0 |
| 1994 | 9 | 0 |
| 1995 | 8 | 0 |
| 1996 | 6 | 0 |
| 1997 | 11 | 0 |
| 1998 | 18 | 0 |
| 1999 | 11 | 0 |
| 2000 | 16 | 0 |
| 2001 | 13 | 8 |
| 2002 | 23 | 15 |
| 2003 | 17 | 22 |
| 2004 | 16 | 22 |
| 2005 | 12 | 30 |
| 2006 | 9 | 32 |
| 2007 | 12 | 34 |
| 2008 | 10 | 58 |
| 2009 | 14 | 44 |
| 2010 | 25 | 47 |
| 2011 | 28 | 31 |
| 2012 | 19 | 24 |
| 2013 | 23 | 18 |
| 2014 | 25 | 20 |
| 2015 | 15 | 18 |
| 2016 | 18 | 23 |
| 2017 | 20 | 21 |
| 2018 | 15 | 29 |
| 2019 | 20 | 35 |
| 2020 | 36 | 34 |
| 2021 | 27 | 34 |
| 2022 | 19 | 33 |
| 2023 | 28 | 46 |
| 2024 | 23 | 53 |
| 2025 | 31 | 38 |
| 2026 | 29 | 16 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for etching an etch layer6 Oct 2026US 12,757,660 B2Lam Research Corporation
- Seal structure, substrate processing apparatus, substrate processing method and method of manufacturing semiconductor device15 Sep 2026US 12,738,461 B2Kokusai Electric Corporation
- Magnetization device for an electron microscope and method8 Sep 2026US 12,731,756 B2Forschungszentrum Julich GmbH
- In situ biasing and freezing of cyrogenic electron microscopy samples1 Sep 2026US 12,723,955 B2Alliance for Energy Innovation, LLC
- Method of forming silicon nitride film and film forming apparatus25 Aug 2026US 12,721,063 B2Tokyo Electron Limited
- Etching method and plasma processing apparatus17 Sep 2026US 2026/0279742 A1Tokyo Electron Limited
- Methods and systems for forming a layer comprising silicon oxide17 Sep 2026US 2026/0282775 A1ASM IP Holding B. V.
- Substrate processing apparatus and substrate temperature control method17 Sep 2026US 2026/0282802 A1Tokyo Electron Limited
- Workstation, preparation station and method for manipulating an electron microscopy grid assembly3 Sep 2026US 2026/0260839 A1Max-Planck-Gesellschaft Zur FöRderung Der Wissenschaften E. V.
- Measurement Method and Charged Particle Beam Device23 Jul 2026US 2026/0213124 A1Hitachi High-Tech Corporation
Most cited
By later US patents
- Thermally floating pedestal collar in a chemical vapor deposition chamber805US 5,846,332 AAPPLIED Materials.Inc. · 1998
- Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support659US 6,847,014 B1Lam Research Corporation · 2005
- Apparatus for substrate processing with improved throughput and yield568US 6,129,044 AAPPLIED Materials.Inc. · 2000
- Low temperature CVD process with selected stress of the CVD layer on CMOS devices559US 7,393,765 B2APPLIED Materials.Inc. · 2008
- Lateral temperature equalizing system for large area surfaces during processing550US 7,195,693 B2Advanced Thermal Sciences Corp. · 2007