US 2026/0282802 A1Published application

Substrate processing apparatus and substrate temperature control method

AssigneeTokyo Electron Limited

InventorMasaharu OYA

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Abstract

A substrate processing apparatus includes: a stage for a substrate; a chamber and a heat source that inputs heat to the substrate placed on the stage; a cooling structure located on the stage and cools the stage; a heater that heats the stage, the heater is located between a placement surface of the stage and the cooling structure, the heater to control a heating value; a temperature sensor that measures a temperature of the stage; acquisition circuitry that periodically acquires a heating value of the heater, the temperature of the stage, and a temperature of the cooling structure; prediction circuitry that predicts, from the heating value of the heater, the temperature of the stage, and the temperature of the cooling structure acquired by the acquisition circuitry, a time derivative of the temperature of the stage, and a time derivative of the temperature of the cooling structure.

Claims20

Dependent claims

A substrate processing apparatus comprising:

a stage that supports a substrate;
a chamber in which the stage is located and a heat source that inputs heat to the substrate placed on the stage;
a cooling structure that is located on the stage and cools the stage;
a heater that heats the stage, the heater is located between a placement surface of the stage on which the substrate is placed and the cooling structure, the heater to control a heating value;
a temperature sensor that measures a temperature of the stage;
acquisition circuitry that periodically acquires a heating value of the heater, the temperature of the stage, and a temperature of the cooling structure;
prediction circuitry that predicts, from the heating value of the heater, the temperature of the stage, and the temperature of the cooling structure acquired by the acquisition circuitry, a time derivative of the temperature of the stage, and a time derivative of the temperature of the cooling structure, a temperature of the substrate by using a calculation formula for predicting the temperature of the substrate from the heating value of the heater, the temperature of the stage, the temperature of the cooling structure, the time derivative of the temperature of the stage, and the time derivative of the temperature of the cooling structure;
and
heat generation controller circuitry that controls the heating value of the heater such that the temperature of the substrate predicted by the prediction circuitry becomes a predetermined temperature.

6 more elements

Dependencies are inferred from the claim text.