H01J 2237/049
Focusing means
H01J2237/049 (Focusing means) appears on 380 US grants and 410 published applications in this corpus.
Search patents in H01J- Granted patents
- 380
- Published applications
- 410
- Assignees
- 129
- Inventors
- 693
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 5 | 0 |
| 1995 | 4 | 0 |
| 1996 | 3 | 0 |
| 1997 | 2 | 0 |
| 1998 | 4 | 0 |
| 1999 | 6 | 0 |
| 2000 | 1 | 0 |
| 2001 | 6 | 1 |
| 2002 | 1 | 1 |
| 2003 | 2 | 5 |
| 2004 | 6 | 8 |
| 2005 | 4 | 9 |
| 2006 | 10 | 13 |
| 2007 | 10 | 8 |
| 2008 | 9 | 13 |
| 2009 | 7 | 16 |
| 2010 | 9 | 9 |
| 2011 | 12 | 15 |
| 2012 | 16 | 18 |
| 2013 | 16 | 12 |
| 2014 | 17 | 12 |
| 2015 | 17 | 23 |
| 2016 | 18 | 18 |
| 2017 | 15 | 17 |
| 2018 | 16 | 14 |
| 2019 | 24 | 26 |
| 2020 | 18 | 32 |
| 2021 | 23 | 26 |
| 2022 | 27 | 25 |
| 2023 | 19 | 26 |
| 2024 | 18 | 23 |
| 2025 | 19 | 24 |
| 2026 | 11 | 16 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Aberration correction systems and charged particle microscope systems including the same29 Sep 2026US 12,749,644 B2FEI Company
- Charged particle beam device and specimen observation method15 Sep 2026US 12,738,442 B2Hitachi High-Tech Corporation
- Detector substrate for use in a charged particle multi-beam assessment tool11 Aug 2026US 12,706,272 B2ASML Netherlands B. V.
- Objective lens array assembly, electron-optical system, electron-optical system array, method of focusing4 Aug 2026US 12,700,566 B2ASML Netherlands B. V.
- Bottom and middle edge rings28 Jul 2026US 12,695,067 B2Lam Research Corporation
- Particle beam microscope24 Sep 2026US 2026/0290747 A1
- Semiconductor manufacturing apparatus including reflector2 Jul 2026US 2026/0188604 A1Samsung Electronics Co., Ltd.
- Substrate processing device18 Jun 2026US 2026/0173245 A1Samsung Electronics Co., Ltd.
- Charged particle beam energy width reduction apparatus, method of operating thereof, and charged particle beam device11 Jun 2026US 2026/0162924 A1ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH
- Multiple charged-particle beam apparatus and methods of operating the same11 Jun 2026US 2026/0162932 A1ASML Netherlands B. V.
Most cited
By later US patents
- Charged particle beam apparatus and method for operating the same178US 7,045,781 B2ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH · 2006
- Charged particle beam apparatus and method for operating the same159US 7,274,018 B2ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH · 2007
- Pattern inspection apparatus and electron beam apparatus86US 5,557,105 AFujitsu Limited · 1996
- Ion beam lithography71US 4,985,634 AOesterreichische Investitionskredit Aktiengesellschaft and Ionen Mikrofabrications · 1991
- Charged particle beamlet exposure system64US 7,084,414 B2Mapper Lithography IP B.V. · 2006