H01G 4/306
Made by thin film techniques
Official title: {made by thin film techniques}
H01G4/306 (Made by thin film techniques) appears on 245 US grants and 260 published applications in this corpus.
Search patents in H01G- Granted patents
- 245
- Published applications
- 260
- Assignees
- 113
- Inventors
- 652
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 6 | 0 |
| 1996 | 3 | 0 |
| 1997 | 2 | 0 |
| 1998 | 3 | 0 |
| 1999 | 3 | 0 |
| 2000 | 4 | 0 |
| 2001 | 2 | 2 |
| 2002 | 3 | 0 |
| 2003 | 1 | 2 |
| 2004 | 1 | 0 |
| 2005 | 2 | 2 |
| 2006 | 0 | 3 |
| 2007 | 0 | 3 |
| 2008 | 3 | 7 |
| 2009 | 5 | 3 |
| 2010 | 1 | 2 |
| 2011 | 3 | 3 |
| 2012 | 2 | 7 |
| 2013 | 8 | 11 |
| 2014 | 5 | 6 |
| 2015 | 11 | 18 |
| 2016 | 9 | 15 |
| 2017 | 12 | 24 |
| 2018 | 17 | 26 |
| 2019 | 29 | 12 |
| 2020 | 12 | 17 |
| 2021 | 16 | 15 |
| 2022 | 11 | 23 |
| 2023 | 17 | 19 |
| 2024 | 10 | 18 |
| 2025 | 19 | 11 |
| 2026 | 11 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- High-density capacitive device having well-defined insulating areas15 Sep 2026US 12,738,427 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- High permittivity antiferroelectric and manufacturing method thereof16 Jun 2026US 12,655,067 B2Hyundai Motor Company
- Silicon capacitor with thin film deposition on 3D structure and its manufacturing method2 Jun 2026US 12,646,655 B2Elspes Inc.
- Multilayer ceramic capacitor and mounting structure of multilayer ceramic capacitor26 May 2026US 12,640,314 B2Murata Manufacturing Co., Ltd.
- Method of manufacturing electronic component12 May 2026US 12,626,865 B2Murata Manufacturing Co., Ltd.
- Multilayer ceramic capacitor and method of manufacturing the same17 Sep 2026US 2026/0279686 A1Samsung Electro-Mechanics Co., Ltd.
- Capacitor sheet, capacitor, and electronic component including the same20 Aug 2026US 2026/0245798 A1TDK Corporation
- Capacitor wafer and method for manufacturing the same23 Jul 2026US 2026/0213075 A1AP Memory Technology Corp.
- Capacitor component and integrated circuit chip package including same23 Jul 2026US 2026/0213079 A1Point Engineering Co., Ltd.
- Multilayer ceramic capacitor9 Jul 2026US 2026/0196408 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- High speed process for coating substrates265US 4,842,893 ASpectrum Control, Inc. · 1989
- Method of making a multi-layered article229US 5,032,461 ASpectrum Control, Inc. · 1991
- Direct stacked and flip chip power semiconductor device structures216US 5,532,512 AGeneral Electric Company · 1996
- High speed apparatus for forming capacitors135US 5,097,800 ASpectrum Control, Inc. · 1992
- Miniaturized monolithic multi-layer capacitor and apparatus and method for making124US 5,018,048 ASpectrum Control, Inc. · 1991