Method of manufacturing electronic component

Abstract

A method of manufacturing an electronic component including a multilayer body including a multilayer main body including end surfaces at which internal nickel electrode layers are exposed, side gap portions, external nickel layers on the end surfaces of the multilayer body, and external copper electrode layers covering the end surfaces on which the external nickel layers are provided. Forming at least one of a nickel-based oxide and a silicon-based oxide between the external nickel layer and the external copper electrode layer. Forming a nickel layer and a tin layer outside the external copper electrode layer. In a cross section passing through a middle of the electronic component in the width direction and extending in the length direction and the lamination direction, a relationship of about 0.2≤Tea/Tem≤about 1.1 is satisfied.

Dependencies are inferred from the claim text.