H01G 4/30
Stacked capacitors
Official title: Stacked capacitors (H01G4/33 takes precedence)
H01G4/30 (Stacked capacitors) appears on 5,528 US grants and 6,795 published applications in this corpus.
Search patents in H01G- Granted patents
- 5,528
- Published applications
- 6,795
- Assignees
- 623
- Inventors
- 5,921
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 8 | 0 |
| 1978 | 7 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 5 | 0 |
| 1982 | 6 | 0 |
| 1983 | 9 | 0 |
| 1984 | 12 | 0 |
| 1985 | 7 | 0 |
| 1986 | 13 | 0 |
| 1987 | 14 | 0 |
| 1988 | 10 | 0 |
| 1989 | 17 | 0 |
| 1990 | 11 | 0 |
| 1991 | 14 | 0 |
| 1992 | 12 | 0 |
| 1993 | 12 | 0 |
| 1994 | 13 | 0 |
| 1995 | 17 | 0 |
| 1996 | 16 | 0 |
| 1997 | 12 | 0 |
| 1998 | 20 | 0 |
| 1999 | 14 | 0 |
| 2000 | 27 | 0 |
| 2001 | 32 | 18 |
| 2002 | 40 | 33 |
| 2003 | 35 | 43 |
| 2004 | 48 | 72 |
| 2005 | 51 | 68 |
| 2006 | 64 | 126 |
| 2007 | 72 | 152 |
| 2008 | 92 | 145 |
| 2009 | 109 | 154 |
| 2010 | 106 | 143 |
| 2011 | 89 | 118 |
| 2012 | 125 | 175 |
| 2013 | 134 | 233 |
| 2014 | 136 | 288 |
| 2015 | 228 | 333 |
| 2016 | 292 | 329 |
| 2017 | 294 | 366 |
| 2018 | 307 | 351 |
| 2019 | 408 | 359 |
| 2020 | 372 | 444 |
| 2021 | 344 | 410 |
| 2022 | 346 | 458 |
| 2023 | 441 | 495 |
| 2024 | 388 | 468 |
| 2025 | 405 | 535 |
| 2026 | 289 | 479 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Capacitor having a support part joined to a capacitance forming part6 Oct 2026US 12,755,903 B2Murata Manufacturing Co., Ltd.
- Electronic component with surface electrode layer6 Oct 2026US 12,755,904 B2TDK Corporation
- Multilayer ceramic capacitor with external electrode having a carbon layer6 Oct 2026US 12,755,905 B2Samsung Electro-Mechanics Co., Ltd.
- Multilayer ceramic capacitor and method of manufacturing the same29 Sep 2026US 12,749,622 B2Samsung Electro-Mechanics Co., Ltd.
- Multilayered capacitor and manufacturing method thereof29 Sep 2026US 12,749,623 B2Samsung Electro-Mechanics Co., Ltd.
- Multilayer electronic component8 Oct 2026US 2026/0311932 A1Samsung Electro-Mechanics Co., Ltd.
- Dielectric ceramic, method of preparing the same, and multilayer ceramic capacitor including the same8 Oct 2026US 2026/0311933 A1Samsung Electro-Mechanics Co., Ltd.
- Multilayer ceramic capacitor8 Oct 2026US 2026/0311934 A1Murata Manufacturing Co., Ltd.
- Filter, preparation method thereof, and electronic apparatus8 Oct 2026US 2026/0312561 A1Beijing BOE Sensor Technology Co., Ltd.
- Dielectric ceramic composition and multilayer ceramic electronic device1 Oct 2026US 2026/0296979 A1TDK Corporation
Most cited
By later US patents
- High speed process for coating substrates265US 4,842,893 ASpectrum Control, Inc. · 1989
- Supercapacitor structure247US 6,181,545 B2Telcordia Technologies, Inc. · 2001
- Method of making a multi-layered article229US 5,032,461 ASpectrum Control, Inc. · 1991
- Surface mount multilayer capacitor225US 5,880,925 AAVX Corporation · 1999
- Direct stacked and flip chip power semiconductor device structures216US 5,532,512 AGeneral Electric Company · 1996