H01G 4/302
Obtained by injection of metal in cavities formed in a ceramic body
Official title: {obtained by injection of metal in cavities formed in a ceramic body}
H01G4/302 (Obtained by injection of metal in cavities formed in a ceramic body) appears on 54 US grants and 37 published applications in this corpus.
Search patents in H01G- Granted patents
- 54
- Published applications
- 37
- Assignees
- 22
- Inventors
- 91
- Latest grant
- 13 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 3 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 3 | 0 |
| 1988 | 0 | 0 |
| 1989 | 3 | 0 |
| 1990 | 3 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 1 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 0 | 1 |
| 2011 | 1 | 2 |
| 2012 | 1 | 2 |
| 2013 | 2 | 7 |
| 2014 | 3 | 4 |
| 2015 | 4 | 2 |
| 2016 | 2 | 2 |
| 2017 | 1 | 4 |
| 2018 | 1 | 1 |
| 2019 | 4 | 1 |
| 2020 | 2 | 2 |
| 2021 | 1 | 1 |
| 2022 | 1 | 2 |
| 2023 | 2 | 4 |
| 2024 | 2 | 1 |
| 2025 | 2 | 0 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of reducing size of dielectric particles in dielectric slurry13 Jan 2026US 12,525,398 B2Samsung Electro-Mechanics Co., Ltd.
- Multilayer ceramic capacitor and circuit board17 Jun 2025US 12,334,273 B2Taiyo Yuden Co., Ltd.
- Multilayer ceramic electronic device and manufacturing method of the same7 Jan 2025US 12,191,086 B2Taiyo Yuden Co., Ltd.
- Method for manufacturing conductive paste and method for manufacturing multilayer ceramic electronic component10 Sep 2024US 12,087,464 B2Samsung Electro-Mechanics Co., Ltd.
- Ceramic electronic device having an element body with a boundary layer including Ba and Ti at an end of a ceramic layer16 Apr 2024US 11,961,675 B2TDK Corporation
- Multilayered capacitor and method for manufacturing the same15 Feb 2024US 2024/0055188 A1Samsung Electro-Mechanics Co., Ltd.
- Multilayer ceramic electronic device and manufacturing method of the same14 Sep 2023US 2023/0290577 A1Taiyo Yuden Co., Ltd.
- Multilayer ceramic capacitor and circuit board24 Aug 2023US 2023/0268132 A1Taiyo Yuden Co., Ltd.
- Method for manufacturing conductive paste and method for manufacturing multilayer ceramic electronic component10 Aug 2023US 2023/0253131 A1Samsung Electro-Mechanics Co., Ltd.
- Manufacturing method of dielectric slurry and manufacturing method of multilayer capacitor1 Jun 2023US 2023/0170144 A1Samsung Electro-Mechanics Co., Ltd.
Most cited
By later US patents
- Electrical multilayer component comprising a sintered, monolithic ceramic body and method for its manufacture51US 4,819,128 ASiemens Aktiengesellschaft · 1989
- Process for forming internal conductors and electrodes32US 3,965,552 AN L Industries, Inc. · 1976
- Ceramic matrices for electronic devices and process for forming same31US 4,353,957 ATam Ceramics, Inc. · 1982
- Method for manufacturing multi-layer ceramic capacitor29US 5,311,651 AKorea Institute of Science and Technology (KIST) · 1994
- Dielectric ceramic matrices with end barriers28US 4,030,004 ANL Industries, Inc. · 1977