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US 12,087,464 B2Granted
Method for manufacturing conductive paste and method for manufacturing multilayer ceramic electronic component
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsTae Gyun Kwon, Eung Seok Lee
Life of this patent
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Abstract
A method for manufacturing a conductive paste includes preparing a first solution including a metal particle and a first solvent, preparing a second solvent, preparing a surfactant including a core particle and an organic material disposed on a surface of the core particle, and mixing the first solution, the second solvent, and the surfactant to form a mixed solution.
Claims28
A method for manufacturing a conductive paste, comprising:
- preparing a first solution including a metal particle and a first solvent;
- preparing a second solvent;
- preparing a surfactant including a core particle and an organic material bonded to a surface of the core particle;
- and
- mixing the first solution, the second solvent, and the surfactant to form a mixed solution,
- wherein one solvent among the first solvent and the second solvent is a hydrophobic solvent, and the other solvent is a hydrophilic solvent.
3 more elements
A method for manufacturing a conductive paste, comprising:
- preparing a first solution including a metal particle and a first solvent;
- preparing a second solvent;
- preparing a surfactant including a core particle and an organic material bonded to a surface of the core particle;
- and
- mixing the first solution, the second solvent, and the surfactant to form a mixed solution;
- and
- emulsifying the mixed solution by sonication.
4 more elements
A method for manufacturing a conductive paste, comprising:
- preparing a first solution including a metal particle and a first solvent;
- preparing a second solvent;
- preparing a surfactant including a core particle and an organic material bonded to a surface of the core particle;
- and
- mixing the first solution, the second solvent, and the surfactant to form a mixed solution,
- wherein the first solvent is the hydrophobic solvent, and the second solvent is the hydrophilic solvent,
- wherein a ratio of a volume of the first solution to a volume of the second solvent is 1 or less, and
- wherein the core particle includes at least one of gold (Au), silver (Ag), and platinum (Pt).
5 more elements
Dependencies are inferred from the claim text.