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US 2023/0253131 A1Published application
Method for manufacturing conductive paste and method for manufacturing multilayer ceramic electronic component
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsTae Gyun Kwon, Eung Seok Lee
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Abstract
A method for manufacturing a conductive paste includes preparing a first solution including a metal particle and a first solvent, preparing a second solvent, preparing a surfactant including a core particle and an organic material disposed on a surface of the core particle, and mixing the first solution, the second solvent, and the surfactant to form a mixed solution.
Claims28
A method for manufacturing a conductive paste, comprising:
- preparing a first solution including a metal particle and a first solvent;
- preparing a second solvent;
- preparing a surfactant including a core particle and an organic material disposed on a surface of the core particle;
- and
- mixing the first solution, the second solvent, and the surfactant to form a mixed solution.
2 more elements
A method for manufacturing a multilayer ceramic electronic component, comprising:
- preparing a ceramic green sheet;
- applying a conductive paste including a first solution including a metal particle and a first solvent, a second solvent, and a surfactant including a core particle and an organic material disposed on a surface of the core particle, on the ceramic green sheet;
- forming a ceramic laminate by stacking the ceramic green sheet to which the conductive paste is applied;
- and
- sintering the ceramic laminate.
2 more elements
A method for manufacturing a conductive paste, comprising:
- mixing a first solution including a metal particle and a first solvent, a second solvent, and a surfactant to form a mixed solution,
- wherein at least one of the first and second solvents is a hydrophilic solvent, and
- the method excludes removing the hydrophilic solvent from the mixed solution.
Dependencies are inferred from the claim text.