H01G 4/308
Made by transfer techniques
Official title: {made by transfer techniques}
H01G4/308 (Made by transfer techniques) appears on 109 US grants and 93 published applications in this corpus.
Search patents in H01G- Granted patents
- 109
- Published applications
- 93
- Assignees
- 36
- Inventors
- 288
- Latest grant
- 21 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 5 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 2 | 0 |
| 1996 | 4 | 0 |
| 1997 | 2 | 0 |
| 1998 | 4 | 0 |
| 1999 | 4 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 2 |
| 2002 | 2 | 2 |
| 2003 | 2 | 5 |
| 2004 | 5 | 2 |
| 2005 | 0 | 2 |
| 2006 | 2 | 8 |
| 2007 | 1 | 3 |
| 2008 | 3 | 7 |
| 2009 | 5 | 2 |
| 2010 | 3 | 6 |
| 2011 | 2 | 1 |
| 2012 | 1 | 3 |
| 2013 | 3 | 3 |
| 2014 | 2 | 5 |
| 2015 | 4 | 4 |
| 2016 | 3 | 0 |
| 2017 | 3 | 13 |
| 2018 | 8 | 7 |
| 2019 | 9 | 7 |
| 2020 | 4 | 3 |
| 2021 | 4 | 3 |
| 2022 | 3 | 1 |
| 2023 | 2 | 2 |
| 2024 | 2 | 1 |
| 2025 | 0 | 1 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Laminated ceramic capacitor having intra-shell pores in core-shell ceramic grains and method of manufacturing the same21 Apr 2026US 12,609,244 B2Taiyo Yuden Co., Ltd.
- Multilayer electronic component and method of manufacturing the same4 Jun 2024US 12,002,627 B2Samsung Electro-Mechanics Co., Ltd.
- Multilayer electronic component13 Feb 2024US 11,901,130 B2Samsung Electro-Mechanics Co., Ltd.
- Film capacitor, film-capacitor film, and method for manufacturing film-capacitor film25 Jul 2023US 11,710,602 B2Murata Manufacturing Co., Ltd.
- Multilayer electronic component and manufacturing method thereof21 Feb 2023US 11,587,735 B2Samsung Electro-Mechanics Co., Ltd.
- Release film and method for manufacturing multilayer electronic component using the same27 Mar 2025US 2025/0104915 A1Samsung Electro-Mechanics Co., Ltd.
- Laminated ceramic capacitor and method of manufacturing laminated ceramic capacitor5 Dec 2024US 2024/0404753 A1Taiyo Yuden Co., Ltd.
- Multilayer electronic component and method of manufacturing the same29 Jun 2023US 2023/0207209 A1Samsung Electro-Mechanics Co., Ltd.
- Multilayer electronic component18 May 2023US 2023/0154684 A1Samsung Electro-Mechanics Co., Ltd.
- Multilayer ceramic electronic component and method of manufacturing the same9 Jun 2022US 2022/0181083 A1Samsung Electro-Mechanics Co., Ltd.
Most cited
By later US patents
- High power capacitor91US 5,623,724 ANorthrop Grumman Corporation · 1997
- Electrical multilayer component comprising a sintered, monolithic ceramic body and method for its manufacture51US 4,819,128 ASiemens Aktiengesellschaft · 1989
- Method of fabricating ceramic green sheets with supporting films33US 5,603,793 AMurata Manufacturing Co., Ltd. · 1997
- Method for producing multilayer substrate and electronic part, and multilayer electronic part33US 6,808,642 B2TDK Corporation · 2004
- Method for manufacturing laminated-ceramic electronic components31US 6,485,591 B1Matsushita Electric Industrial Co., Ltd. · 2002