Multilayer ceramic electronic component and method of manufacturing the same

A multilayer ceramic electronic component comprising;

• a ceramic body including a dielectric layer, and a first internal electrode and a second internal electrode disposed to face each other with the dielectric layer interposed therebetween;
• a first external electrode connected to the first internal electrode;
• and
• a second external electrode connected to the second internal electrode,
• wherein the ceramic body includes a capacitance formation portion having first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction, the capacitance formation portion including the first and second internal electrodes stacked in the third direction to form capacitance, the ceramic body including a first margin portion disposed on the third and fifth surfaces and a second margin portion disposed on the fourth and sixth surfaces.

A multilayer ceramic electronic component comprising:

• a ceramic body including a dielectric layer and a first internal electrode and a second internal electrode disposed to face each other with the dielectric layer interposed therebetween;
• a first external electrode connected to the first internal electrode;
• and
• a second external electrode connected to the second internal electrode,
• wherein the ceramic body includes a capacitance formation portion having a first surface and a second surface opposing each other in a first direction, a third surface and a fourth surface opposing each other in a second direction, and a fifth surface and a sixth surface opposing each other in a third direction, the capacitance formation portion including the first internal electrode and the second internal electrode stacked in the third direction to form capacitance,
• the ceramic body includes margin portions disposed on third to sixth surfaces, and
• in a second direction-third direction cross section, interfaces between the margin portions are disposed only at two diagonal corners of the ceramic body.

A method for manufacturing a multilayer ceramic electronic component, the method comprising:

• forming a capacitance formation portion having a first surface and a second surface opposing each other in a first direction, a third surface and a fourth surface opposing each other in a second direction, and a fifth surface and a sixth surface opposing each other in a third direction, the capacitance formation portion including the first internal electrode and the second internal electrode stacked in the third direction to form capacitance;
• simultaneously forming a first margin portion on the third surface and the fifth surface;
• simultaneously forming a second margin portion on the fourth surface and the sixth surface;
• forming a first external electrode to connect to the first internal electrode;
• and
• forming a second external electrode to connect to the second internal electrode.