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US 2025/0104915 A1Published application
Release film and method for manufacturing multilayer electronic component using the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsDae Jin SHIM, Jung Jin PARK, Jung Jin PARK, Jae Won KIM, Hyo Sung CHOI, Nam Ju YOO, Jung Hee KIM, Jong Ho LEE
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Abstract
A release film including: a base film; and a release layer disposed on one surface of the base film, wherein the release layer is a cured layer of a release composition including a heterocyclic compound including nitrogen and polydimethylsiloxane, and when analyzing a surface using X-ray photoelectron spectroscopy (XPS), the release layer has an atomic ratio of nitrogen (N) to silicon (Si) (N/Si) of 0.6 to 1.1.
Claims19
A release film, comprising:
- a base film;
- and
- a release layer disposed on a first surface of the base film,
- wherein the release layer includes a cured product of a release composition including a heterocyclic compound including nitrogen and polydimethylsiloxane, and
- when analyzing a surface of the release layer using X-ray photoelectron spectroscopy (XPS), the release layer has an atomic ratio of nitrogen (N) to silicon (Si) (N/Si) of 0.6 to 1.1.
2 more elements
Dependencies are inferred from the claim text.