US 6,485,591 B1Granted

Method for manufacturing laminated-ceramic electronic components

AssigneeMatsushita Electric Industrial Co., Ltd.

InventorsKeiichi Nakao, Hideyuki Okinaka, Yasutaka Horibe, Hikoji Okuyama, Masahiro Katoh, Takashi Iguchi, Akira Ohmi, Yoshiyuki Miura

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Abstract

The invention relates to a method of laminating ceramic greenware sheets with electrodes embedded therein (25) which is formed on a support by pressure-adhering a ceramic greenware sheet with an electrode embedded therein onto a second ceramic greenware sheet or other electrodes (23), then peeling off the support alone and transferring the ceramic greenware sheet with the embedded electrodes onto the second ceramic greenware sheet or the other electrodes. This manufacturing method enables it to laminate ceramic greenware sheets each the thickness of which is as thin as 20 micrometers or less, while maintaining their mechanical strength and embedded electrodes in the ceramic greenware sheets, thereby enabling it to prevent a occurrence of surface irregularities due to the thickness of the electrodes even when laminating to a high degree.

Claims13

Dependent claims

A method for manufacturing laminated-ceramic electronic components, comprising the steps of:

a. forming a first plurality of electrodes on a first support;
b. forming, on the first support, a first ceramic greenware sheet with the first plurality of electrodes embedded therein by applying a ceramic slurry onto the first plurality of electrodes;
c. laminating the first ceramic greenware sheet in contact with a surface of a second ceramic greenware sheet by pressing the first ceramic greenware sheet via the first support and heating the first ceramic greenware sheet;
d. peeling off the first support from the first ceramic greenware sheet being laminated;
e. forming a second plurality of electrodes on a second support;
f. forming, on the second support, a third ceramic greenware sheet with the second plurality of electrodes embedded therein by applying a ceramic slurry onto the second plurality of electrodes;
g. laminating the third ceramic greenware sheet in contact with a surface of the first greenware sheet from which the first support has been peeled off by pressing the third ceramic greenware sheet via the second support and heating the third ceramic greenware sheet to form a ceramic laminated structure having the second support;
h. peeling off the second support from the ceramic laminated structure;
and
i. sintering the ceramic laminated structure.

7 more elements

A method for manufacturing a laminated-ceramic capacitor, comprising the steps of:

a. forming a first plurality of electrodes on a first support;
b. forming, on the first support, a first ceramic greenware sheet with the first plurality of electrodes embedded therein by applying a ceramic slurry onto the first plurality of electrodes, the first ceramic greenware sheet having a thickness of 20 micrometers or less;
c. laminating the first ceramic greenware sheet in contact with a surface of a second greenware sheet by pressing the first ceramic greenware sheet via the first support and heating the first ceramic greenware sheet;
d. peeling off the first support from the first ceramic greenware sheet being laminated;
e. forming a second plurality of electrodes on a second support;
f. forming, on the second support, a third ceramic greenware sheet with the second plurality of electrodes embedded therein by applying a ceramic slurry onto the second plurality of electrodes;
g. laminating the third ceramic greenware sheet in contact with a surface of the first ceramic greenware sheet from which the first support has been peeled off by pressing the third ceramic greenware sheet via the second support and heating the third ceramic greenware sheet to form a ceramic laminated structure having the second support;
h. peeling off the second support from the ceramic laminated structure;
and
i. sintering the laminated structure.

7 more elements

Dependencies are inferred from the claim text.

Facts

Application: 08/286,098Filed 4 Aug 1994 · continuation
Priority: JP 63-528217 Mar 1988
Granted: 26 Nov 2002
Term ends: Not estimatedThe source records don’t support an estimate.

Classification17 codes

B28B 19/0015
Machines or methods for applying the material to surfaces to form a permanent layer thereon: on multilayered articles
C04B 41/4511
Characterised by the method of application: using temporarily supports, e.g. decalcomania transfers or mould surfaces
C04B 41/5194
Metallising , e.g. infiltration of sintered ceramic preforms with molten metal: metallisation of multilayered ceramics, e.g. for the fabrication…
H01C 7/10
Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered…:…

Family

PCT/JP99/00240Parent of this continuation · filed 7 Mar 1989
Application07/794,310Parent of this continuation · filed 14 Nov 1991
Application08/009,431Parent of this continuation · filed 27 Jan 1993
Application07/444,167Parent of this continuation
US 6,485,591 B1This patent

From the US filing history. Foreign family members aren’t listed.