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US 2023/0154684 A1Published application
Multilayer electronic component
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJin Soo PARK, Myung Jun PARK, Hyun Hee GU, Bum Soo KIM, Yeon Song KANG, Duk Hyun CHUN, Chung Eun LEE
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Abstract
A multilayer electronic component, in which the external electrode may be thinned to secure capacitance per unit volume, while securing the external electrode at a corner in a specific thickness or higher with improved reliability for moisture resistance.
Claims15
A multilayer electronic component comprising:
- a body including a dielectric layer, and a first internal electrode and a second internal electrode alternately disposed in a first direction with the dielectric layer interposed therebetween, and including a first surface and a second surface opposing each other in the first direction, a third surface and a fourth surface connected to the first and second surfaces and opposing each other in a second direction, and a fifth surface and a sixth surface connected to the first to fourth surfaces and opposing each other in a third direction;
- and
- a first external electrode including a first electrode layer disposed on one of the third and fourth surfaces, a second electrode layer disposed on the first electrode layer, a third electrode layer disposed on the first and second surfaces, and a fourth electrode layer disposed on the second electrode layer and extending onto a portion of the third electrode layer,
- wherein the first external electrode further comprises a plating layer disposed on a portion of the third electrode layer that is exposed from the fourth electrode layer, and disposed on the fourth electrode layer.
1 more element
Dependencies are inferred from the claim text.