G11C 16/18
Circuits for erasing optically
G11C16/18 (Circuits for erasing optically) appears on 89 US grants and 29 published applications in this corpus.
Search patents in G11C- Granted patents
- 89
- Published applications
- 29
- Assignees
- 49
- Inventors
- 147
- Latest grant
- 28 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 6 | 0 |
| 1988 | 7 | 0 |
| 1989 | 3 | 0 |
| 1990 | 3 | 0 |
| 1991 | 7 | 0 |
| 1992 | 4 | 0 |
| 1993 | 5 | 0 |
| 1994 | 3 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 2 | 0 |
| 2000 | 4 | 0 |
| 2001 | 3 | 1 |
| 2002 | 1 | 1 |
| 2003 | 1 | 0 |
| 2004 | 0 | 3 |
| 2005 | 2 | 2 |
| 2006 | 2 | 2 |
| 2007 | 3 | 2 |
| 2008 | 0 | 0 |
| 2009 | 1 | 2 |
| 2010 | 1 | 0 |
| 2011 | 1 | 3 |
| 2012 | 0 | 0 |
| 2013 | 2 | 0 |
| 2014 | 2 | 1 |
| 2015 | 0 | 0 |
| 2016 | 3 | 3 |
| 2017 | 2 | 2 |
| 2018 | 2 | 2 |
| 2019 | 4 | 2 |
| 2020 | 0 | 0 |
| 2021 | 1 | 1 |
| 2022 | 1 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 1 |
| 2025 | 0 | 1 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Automated data erasure device and method28 Jul 2026US 12,693,810 B2
- Dense hybrid package integration of optically programmable chip18 Oct 2022US 11,476,238 B2International Business Machines Corporation
- SoC package with integrated ultraviolet light source22 Jun 2021US 11,043,270 B1International Business Machines Corporation
- Memory device performing UV-assisted erase operation19 Nov 2019US 10,482,976 B2SK hynix Inc.
- Optically restorable semiconductor device, method for fabricating the same, and flash memory device using the same19 Nov 2019US 10,483,300 B2Electronics and Telecommunications Research Institute
- Device and method for automated data erasure in non-volatile memories of electronic devices27 Nov 2025US 2025/0364054 A1
- Automated data erasure device and method27 Jun 2024US 2024/0211164 A1
- Dense Hybrid Package Integration Of Optically Programmable Chip11 Nov 2021US 2021/0351169 A1International Business Machines Corporation
- Memory device performing uv-assisted erase operation3 Jan 2019US 2019/0006011 A1SK hynix Inc.
- Cross-connected multi-chip modules coupled by silicon bent-bridge interconnects and methods of assembling same3 Jan 2019US 2019/0006281 A1Intel IP Corporation
Most cited
By later US patents
- Integrated circuit package having adhesive bead supporting planar lid above planar substrate332US 6,268,654 B1Ankor Technology, Inc. · 2001
- Laser programmable electrically readable phase-change memory method and device183US 6,850,432 B2Macronix International Co., Ltd. · 2005
- Method of resin encapsulating a semiconductor device146US 4,769,344 AMitsubishi Denki Kabushiki Kaisha · 1988
- Shielded EPROM package145US 5,355,016 AMotorola, Inc. · 1994
- Method of making integrated circuit package having adhesive bead supporting planar lid above planar substrate128US 6,117,705 AAmkor Technology, Inc. · 2000