Cross-connected multi-chip modules coupled by silicon bent-bridge interconnects and methods of assembling same

A method of forming a multi-chip module, comprising:

• assembling a central component, a first component and a subsequent component on a carrier;
• assembling a first silicon-bridge interconnect between the central component and the first component;
• assembling a subsequent silicon-bridge interconnect between the central component and the subsequent component;
• and
• deflecting at least one of the silicon bridge interconnects to form a silicon bent-bridge interconnect.

A computing system with a multi-chip module, comprising:

• a central component, wherein the central component is a semiconductive device;
• a first component, wherein the first component is coupled to the central component by a first silicon bent-bridge interconnect;
• a subsequent component, wherein the subsequent component is coupled to the central component by a subsequent silicon-bridge interconnect;
• and
• an external shell that encloses the central component, the first component and the subsequent component.