Dense hybrid package integration of optically programmable chip
AssigneeInternational Business Machines Corporation
InventorsFrank Robert Libsch, Ali Afzali-Ardakani, James B. Hannon
Life of this patent
Estimating the term…
Abstract
An interconnect for a semiconductor device includes: a carrier; a UV programmable chip mounted on the carrier using a first array of solder connections; a UV light source mounted on the carrier using a second array of solder connections, the UV light source being in optical communication with the UV programmable chip; and a plurality of transmission lines extending on or through the carrier and providing electrical communication between the UV programmable chip and the UV light source.
Claims16
An interconnect for a semiconductor device, the interconnect comprising:
- a carrier;
- a UV programmable chip mounted on the carrier using a first array of solder connections;
- a UV light source mounted on the carrier using a second array of solder connections, the UV light source being in optical communication with the UV programmable chip;
- and
- a plurality of transmission lines extending on or through the carrier and providing electrical communication between the UV programmable chip and the UV light source.
An interconnect for a semiconductor device, the interconnect comprising:
- a carrier;
- a UV programmable chip mounted on the carrier using a first array of solder connections;
- a UV light source mounted on the carrier using a second array of solder connections, the UV light source being in optical communication with the UV programmable chip;
- a plurality of bond pads on the carrier;
- and
- a plurality of transmission lines extending on or through the carrier and providing electrical communication between the UV programmable chip and the UV light source and the plurality of bond pads;
- wherein the plurality of bond pads is configured for attachment of the carrier to an electrical substrate.
A method for fabricating an in-field programmable semiconductor device, the method comprising:
- flip chip bonding a UV light source to a first carrier using a first solder;
- flip chip bonding a UV programmable chip to the first carrier using a second solder, wherein the UV light source and the UV programmable chip form an in-field programmable chip;
- attaching the first carrier to an electrical substrate;
- and
- connecting at least one heat sink to the in-field programmable chip.
Dependencies are inferred from the claim text.