Method of making integrated circuit package having adhesive bead supporting planar lid above planar substrate

A method of making a plurality of integrated circuit packages each containing an integrated circuit die, the method comprising:

• providing a planar first sheet of an insulating material, said first sheet including a plurality of physically-joined package substrates, wherein each package substrate has a planar first surface in a common plane;
• placing an integrated circuit die on the planar first surface of each package substrate;
• electrically connecting each integrated circuit die to an electrically conductive path through the die's respective package substrate;
• applying a bead of an adhesive material onto the planar first surface of each package substrate of the first sheet around each integrated circuit die;
• providing a planar second sheet of a material for forming a lid for each package, said second sheet having a planar first surface and an area which is at least sufficient to cover the adhesive beads around the integrated circuit dies;
• placing the planar first surface of said second sheet onto the adhesive beads around the dies such that the planar first surface of the second sheet is supported above all of the planar first surfaces of the package substrates of the first sheet and all of the integrated circuit dies by the adhesive beads;
• hardening the adhesive beads around all of the integrated circuit dies;
• and
• separating individual packages each having a package substrate, an enclosed integrated circuit die, and a lid.

A method of making a package containing an integrated circuit die, the method comprising:

• providing an integrated circuit die;
• providing a planar substrate having a planar first surface and an electrically conductive path through the substrate;
• placing the integrated circuit die on the planar first surface of the substrate;
• electrically connecting a bond wire to a conductive pad on the integrated circuit, said bond wire being electrically connected to the electrically conductive path;
• applying a bead of an adhesive material on the planar first surface of the substrate around the integrated circuit die, said bead covering the bond wire;
• providing a planar lid having a planar first surface;
• placing the planar first surface of the lid onto the bead so that the planar first surface of the lid is above the integrated circuit die;
• and
• hardening the bead.