SoC package with integrated ultraviolet light source
AssigneeInternational Business Machines Corporation
InventorsFrank Robert Libsch, Ali Afzali-Ardakani, James B. Hannon
Life of this patent
Estimating the term…
Abstract
Programmable devices and methods for fabricating the programmable devices are described. In an example, a method for fabricating a programmable device can include bonding a UV light source to a computer chip by flip-chip mounting the UV light source to the computer chip. The UV light source can be configured to emit UV light towards a UV erasable area of the computer chip to perform UV erasing on the computer chip. The method can further include bonding a carrier to the computer chip by flip chip mounting the computer chip to the carrier using a second array of bond pads.
Claims20
A chip package comprising:
- a computer chip;
- an ultraviolet (UV) light source;
- a carrier;
- wherein:
- the UV light source is flip-chip mounted to the computer chip using a first array of bond pads situated between the UV light source and the computer chip;
- the computer chip is flip-chip mounted to the carrier using a second array of bond pads situated between the computer chip and the carrier;
- the UV light source is configured to emit UV light towards a UV erasable area of the computer chip to perform UV erasing on the computer chip.
A chip package comprising:
- a computer chip;
- an ultraviolet (UV) light source;
- a carrier;
- wherein:
- the UV light source is flip-chip mounted to the computer chip using a first array of bond pads situated between the UV light source and the computer chip;
- the computer chip is flip-chip mounted to the carrier using a second array of bond pads situated between the computer chip and the carrier;
- the carrier comprises a recess to fit a portion of the UV light source;
- and
- the UV light source is configured to emit UV light towards a UV erasable area of the computer chip to perform UV erasing on the computer chip.
A method of fabricating a programmable device, the method comprising:
- bonding a UV light source to a computer chip by flip-chip mounting the UV light source to the computer chip, wherein the UV light source is configured to emit UV light towards a UV erasable area of the computer chip to perform UV erasing on the computer chip;
- and
- bonding a carrier to the computer chip by flip chip mounting the computer chip to the carrier using a second array of bond pads.
Dependencies are inferred from the claim text.