G03F 7/36
Imagewise removal not covered by groups g03f7/30 - g03f7/34
Official title: Imagewise removal not covered by groups G03F7/30 - G03F7/34, e.g. using gas streams, using plasma
G03F7/36 (Imagewise removal not covered by groups g03f7/30 - g03f7/34) appears on 402 US grants and 495 published applications in this corpus.
Search patents in G03F- Granted patents
- 402
- Published applications
- 495
- Assignees
- 194
- Inventors
- 1,151
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 3 | 0 |
| 1982 | 1 | 0 |
| 1983 | 7 | 0 |
| 1984 | 6 | 0 |
| 1985 | 3 | 0 |
| 1986 | 4 | 0 |
| 1987 | 3 | 0 |
| 1988 | 1 | 0 |
| 1989 | 4 | 0 |
| 1990 | 2 | 0 |
| 1991 | 5 | 0 |
| 1992 | 6 | 0 |
| 1993 | 8 | 0 |
| 1994 | 5 | 0 |
| 1995 | 5 | 0 |
| 1996 | 3 | 0 |
| 1997 | 5 | 0 |
| 1998 | 4 | 0 |
| 1999 | 7 | 0 |
| 2000 | 4 | 0 |
| 2001 | 8 | 4 |
| 2002 | 2 | 3 |
| 2003 | 5 | 8 |
| 2004 | 4 | 9 |
| 2005 | 6 | 10 |
| 2006 | 11 | 17 |
| 2007 | 5 | 16 |
| 2008 | 7 | 3 |
| 2009 | 4 | 8 |
| 2010 | 2 | 16 |
| 2011 | 3 | 8 |
| 2012 | 6 | 5 |
| 2013 | 8 | 17 |
| 2014 | 9 | 17 |
| 2015 | 21 | 26 |
| 2016 | 24 | 39 |
| 2017 | 25 | 14 |
| 2018 | 17 | 14 |
| 2019 | 23 | 22 |
| 2020 | 13 | 11 |
| 2021 | 9 | 17 |
| 2022 | 7 | 26 |
| 2023 | 16 | 45 |
| 2024 | 17 | 43 |
| 2025 | 36 | 63 |
| 2026 | 23 | 34 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Control of metallic contamination from metal-containing photoresist29 Sep 2026US 12,748,352 B2Lam Research Corporation
- Substrate treatment method, substrate treatment apparatus, and computer storage medium8 Sep 2026US 12,733,422 B2Tokyo Electron Limited
- Method for forming a monodisperse granular film1 Sep 2026US 12,724,349 B2Jinko Solar Co., Ltd.
- Gas-based development of organometallic resist in an oxidizing halogen-donating environment21 Jul 2026US 12,687,778 B2Inpria Corporation
- Developing apparatus30 Jun 2026US 12,672,503 B2Tokyo Electron Limited
- Gas-based development of organometallic resist in an oxidizing halogen-donating environment8 Oct 2026US 2026/0310073 A1Inpria Corporation
- Development method for patterning metal oxide photoresist24 Sep 2026US 2026/0288010 A1Tokyo Electron Limited
- Method and system of endpoint detection in etching process24 Sep 2026US 2026/0293614 A1Tokyo Electron Limited
- Lithography apparatus10 Sep 2026US 2026/0267228 A1Tokyo Electron Limited
- Structured Film and Method of Using Same to Form a Pattern on a Substrate27 Aug 2026US 2026/0251967 A13M Innovative Properties Company
Most cited
By later US patents
- Vacuum-integrated hardmask processes and apparatus389US 9,778,561 B2Lam Research Corporation · 2017
- Dry etching method219US 5,266,157 ASony Corporation · 1993
- Process for forming photoresist mask over integrated circuit structures with critical dimension control139US 5,902,704 ALSI Logic Corporation · 1999
- Method of processing an article in a supercritical atmosphere110US 4,944,837 AHoya Corporation · 1990
- Device for forming flexographic printing plate101US 5,279,697 AMinnesota Mining and Manufacturing Company · 1994