G03F 7/0957
With sensitive layers on both sides of the substrate
Official title: {with sensitive layers on both sides of the substrate}
G03F7/0957 (With sensitive layers on both sides of the substrate) appears on 27 US grants and 27 published applications in this corpus.
Search patents in G03F- Granted patents
- 27
- Published applications
- 27
- Assignees
- 27
- Inventors
- 102
- Latest grant
- 25 Nov 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 1 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 2 | 1 |
| 2011 | 0 | 2 |
| 2012 | 0 | 0 |
| 2013 | 0 | 2 |
| 2014 | 3 | 2 |
| 2015 | 1 | 1 |
| 2016 | 2 | 1 |
| 2017 | 0 | 3 |
| 2018 | 0 | 2 |
| 2019 | 3 | 2 |
| 2020 | 2 | 4 |
| 2021 | 0 | 1 |
| 2022 | 2 | 0 |
| 2023 | 2 | 2 |
| 2024 | 0 | 0 |
| 2025 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Method and device for the exposure of a photosensitive coating25 Nov 2025US 12,481,222 B2EV Group E. Thallner GmbH
- Partition wall for formation of lipid bilayer membrane, and method for producing same21 Mar 2023US 11,607,871 B2Kanagawa Institute of Industrial Science and Technology
- Pattern formation method, laminate, and method of producing touch panel31 Jan 2023US 11,567,410 B2FUJIFILM Corporation
- Method for manufacturing circuit board5 Apr 2022US 11,294,285 B2Avary Holding (Shenzhen) Co., Limited.
- Reduced visibility conductive micro mesh touch sensor1 Mar 2022US 11,261,529 B2Futuretech Capital, Inc.
- Photosensitive multilayer resin film, printed wiring board, semiconductor package, and method for producing printed wiring board2 Oct 2025US 2025/0306465 A1Resonac Corporation
- Method to enhance lithography pattern creation using semiconductor stress film tuning10 Aug 2023US 2023/0251574 A1Tokyo Electron Limited
- Method and device for the exposure of a photosensitive coating10 Aug 2023US 2023/0251580 A1EV Group E. Thallner GmbH
- Reduced visibility conductive micro mesh touch sensor30 Sep 2021US 2021/0301403 A1Futuretech Capital, Inc.
- Partition wall for formation of lipid bilayer membrane, and method for producing same5 Nov 2020US 2020/0346444 A1Kanagawa Institute of Industrial Science and Technology
Most cited
By later US patents
- Method for making device for high resolution electron beam fabrication26US 3,971,860 AInternational Business Machines Corporation · 1976
- Method for forming a patterned layer on a substrate24US 5,334,487 AInternational Business Machines Corporation · 1994
- Method of making submicron circuit structures20US 4,557,995 AInternational Business Machines Corporation · 1985
- Two-sided imaging material18US 6,030,740 ACycolor, Inc. · 2000
- Negative working, peel developable, single sheet color proofing system having a crosslinked layer containing a polymer with phenolic moieties17US 5,300,399 AHoechst Celanese Corporation · 1994