G03F 7/0751
Used as adhesion-promoting additives or as means to improve adhesion
Official title: {used as adhesion-promoting additives or as means to improve adhesion}
G03F7/0751 (Used as adhesion-promoting additives or as means to improve adhesion) appears on 187 US grants and 204 published applications in this corpus.
Search patents in G03F- Granted patents
- 187
- Published applications
- 204
- Assignees
- 93
- Inventors
- 506
- Latest grant
- 21 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 3 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 5 | 0 |
| 2002 | 2 | 2 |
| 2003 | 1 | 7 |
| 2004 | 2 | 10 |
| 2005 | 3 | 8 |
| 2006 | 9 | 6 |
| 2007 | 4 | 5 |
| 2008 | 2 | 8 |
| 2009 | 9 | 11 |
| 2010 | 7 | 8 |
| 2011 | 4 | 8 |
| 2012 | 4 | 15 |
| 2013 | 7 | 17 |
| 2014 | 13 | 10 |
| 2015 | 18 | 19 |
| 2016 | 17 | 16 |
| 2017 | 12 | 11 |
| 2018 | 12 | 7 |
| 2019 | 7 | 6 |
| 2020 | 7 | 9 |
| 2021 | 9 | 4 |
| 2022 | 3 | 3 |
| 2023 | 3 | 2 |
| 2024 | 5 | 5 |
| 2025 | 3 | 3 |
| 2026 | 1 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for producing display device, and display device21 Jul 2026US 12,690,378 B2Sharp Kabushiki Kaisha
- Extreme ultraviolet lithography patterning method9 Dec 2025US 12,494,369 B2Tokyo Electron Limited
- Thermosetting iodine- and silicon-containing material, composition containing the material for forming resist underlayer film for EUV lithography, and patterning process17 Jun 2025US 12,332,565 B2Shin-Etsu Chemical Co., Ltd.
- Adhesion layer for multi-layer photoresist6 May 2025US 12,292,684 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Low temperature cure photoimageable dielectric compositions and methods of their use21 May 2024US 11,988,963 B2
- Extreme ultraviolet lithography patterning method19 Mar 2026US 2026/0082871 A1Tokyo Electron Limited
- Thinner composition, method for substrate processing and modified photoresist12 Mar 2026US 2026/0071151 A1Advanced Echem Materials Company Limited
- Negative photosensitive resin composition, production method for polyimide cured film using same, and polyimide cured film5 Mar 2026US 2026/0063999 A1Asahi Kasei Kabushiki Kaisha
- Composition for forming silicon-containing resist film and patterning process12 Feb 2026US 2026/0044081 A1Shin-Etsu Chemical Co., Ltd.
- Photosensitive resin composition, photosensitive element, printed wiring board, and method for producing printed wiring board28 Aug 2025US 2025/0271758 A1
Most cited
By later US patents
- Color filter66US 5,251,071 ADai Nippon Printing Co.Ltd. · 1993
- Radiation-curable composition for restorative and/or protective treatment of photographic elements63US 4,333,998 AEastman Kodak Company · 1982
- Adhesion promoting product and process for treating an integrated circuit substrate50US 4,732,858 ABrewer Science Inc. · 1988
- Composition for resist underlayer film and method for producing the same39US 6,576,393 B1Jsr Corporation · 2003
- Adhesion promoting product and process for treating an integrated circuit substrate therewith37US 4,950,583 ABrewer Science Inc. · 1990