Adhesion promoting product and process for treating an integrated circuit substrate

In a method of producing microelectronic components and the like by photolithography using a silane adhesion promoter to inhance the bond of coatings to a microelectronic substrate the improvement comprising applying a solution of a silane adhesion promoter to the microelectronic substrate, the solution of a silane adhesion promoter comprising an adhesion promoting organosilane and an aqueous solvent composition containing a hydroxylic solvent, the solution containing between about 0.05 to 0.5 weight percent of an adhesion promoting organosilane in an aqueous solvent composition containing a hydroxylic solvent, the solvent composition consisting essentially of between about 5 to 50 weight percent water and between about 50 to 95 weight percent hydroxylic solvent, the solution being storage stable and the combined aqueous solvent composition containing hydroxylic solvent being effective to enhance the adhesion promoting property of the organosilane when coated with a microelectronic coating and subjected to processing thereof.