Adhesion promoting product and process for treating an integrated circuit substrate therewith

In a method of producing microelectronic components by photolithography the improvement comprising applying an adhesion promoter to the microelectronic component substrate, the adhesion promoter comprising an adhesion promoting alkoxy silane and an activating catalyst, the catalyst being selected from the group consisting of acidic catalysts and basic catalysts, the catalyst being effective to increase the bonding of the alkoxy silane and the combination being effective to increase the bond of a microelectronic coating to the substrate. PG,19

In a method of producing microelectronic components by photolithography the improvement comprising applying an adhesion promoter to a microelectronic substrate, the adhesion promoter comprising an adhesion promoting alkoxy silane and an adjuvant polymer, the polymer being effective when combined with the alkoxy silane to increase the activity of the alkoxy silane and the combination being effective to increase the bond of a microelectronic coating to the substrate.

In a method of producing microelectronic components by photolithography the improvement comprising applying an adhesion promoting alkoxy silane to a microelectronic component substrate, the adhesion promoting alkoxy silane being applied to the microelectronic substrate as a solution, the solution containing between about 0.05-0.5 weight percent alkoxy silane, an adjuvant polymer, the polymer being effective when combined with the alkoxy silane to increase the activity of the alkoxy silane, an adhesion promoting catalyst, the catalyst being effective to increase the bonding of the alkoxy silane and an aqueous solvent, the combination being effective to increase the bond of a microelectronic coating to the substrate.

The method of claim 23 wherein the catalyst is selected from the group consisting of ammonia, water soluble amines, carboxylic acids, sulfonic acids and mineral acids, the catalyst being effective to increase the bonding of the alkoxy silane adhesion promoter and being free of inhibiting and deleterious constituents including anions destructive to microelectronic circuitry.

An adhesion promoter for bonding microelectronic coatings to a substrate to produce microelectronic components comprising a solution of an adhesion promoting alkoxy silane containing between about 0.05-0.5 weight percent alkoxy silane, an adjuvant polymer, the polymer being effective when combined with the alkoxy silane to increase the activity of the alkoxy silane, and an adhesion promoting catalyst, the catalyst being effective to increase the bonding of the alkoxy silane and the combination being effective to increase the bond of a microelectronic coating to a substrate.