G02B 6/4238
Soldering
Official title: {Soldering}
G02B6/4238 (Soldering) appears on 419 US grants and 310 published applications in this corpus.
Search patents in G02B- Granted patents
- 419
- Published applications
- 310
- Assignees
- 218
- Inventors
- 909
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 3 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 11 | 0 |
| 1989 | 11 | 0 |
| 1990 | 5 | 0 |
| 1991 | 12 | 0 |
| 1992 | 3 | 0 |
| 1993 | 5 | 0 |
| 1994 | 8 | 0 |
| 1995 | 7 | 0 |
| 1996 | 8 | 0 |
| 1997 | 14 | 0 |
| 1998 | 14 | 0 |
| 1999 | 12 | 0 |
| 2000 | 14 | 0 |
| 2001 | 17 | 6 |
| 2002 | 22 | 27 |
| 2003 | 24 | 18 |
| 2004 | 20 | 27 |
| 2005 | 22 | 17 |
| 2006 | 11 | 8 |
| 2007 | 13 | 4 |
| 2008 | 7 | 4 |
| 2009 | 5 | 2 |
| 2010 | 1 | 0 |
| 2011 | 3 | 6 |
| 2012 | 3 | 0 |
| 2013 | 2 | 6 |
| 2014 | 5 | 11 |
| 2015 | 3 | 6 |
| 2016 | 11 | 13 |
| 2017 | 12 | 16 |
| 2018 | 16 | 16 |
| 2019 | 11 | 10 |
| 2020 | 15 | 18 |
| 2021 | 10 | 12 |
| 2022 | 11 | 8 |
| 2023 | 8 | 26 |
| 2024 | 5 | 21 |
| 2025 | 14 | 18 |
| 2026 | 12 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Undercut architectures for improved thermal efficiency in photonic integrated circuit (PIC) architectures15 Sep 2026US 12,736,762 B2Altera Corporation
- Optical module25 Aug 2026US 12,717,097 B2LESSENGERS Inc.
- Optical coupling11 Aug 2026US 12,704,688 B2Teramount Ltd.
- Techniques for laser alignment in photonic integrated circuits23 Jun 2026US 12,665,382 B2MACOM Technology Solutions Holdings, Inc.
- On-chip integration of optical components with photonic wire bonds and/or lenses16 Jun 2026US 12,658,668 B2The University of British Columbia
- Bonding structure, photonic integrated circuit, and method for active alignment of optical axis of semiconductor optical device with optical axis of optical circuit on substrate27 Aug 2026US 2026/0251848 A1
- LIDAR System Having Optical Components Coupled Together with Solder28 May 2026US 2026/0147093 A1Aurora Operations, Inc.
- Package devices and methods of manufacture7 May 2026US 2026/0126586 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Optical-electrical integrated device30 Apr 2026US 2026/0118605 A1Shinko Electric Industries Co., Ltd.
- Back side power delivery for wafer-scale integration with laser assisted bonding30 Apr 2026US 2026/0118609 A1Volantis Semiconductor, Inc.
Most cited
By later US patents
- Package for optical devices including optical fiber-to-metal hermetic seal148US 4,119,363 ABell Telephone Laboratories, Incorporated · 1978
- Integrated microelectromechanical alignment and locking apparatus and method for fiber optic module manufacturing111US 6,164,837 AMcDonnell Douglas Corporation · 2000
- Optoelectronic packaging106US 6,456,766 B1Cornell Research Foundation, Inc. · 2002
- Optoelectronics package for a semiconductor laser98US 4,752,109 AAMP Incorporated · 1988
- Optical semiconductor module93US 5,412,748 AKabushiki Kaisha Toshiba · 1995